Bob,
I was trying to find the motivation for this BIRD in the introduction section,
where you wrote this:
The Interconnect Modeling BIRD189 defines three separate interfaces as Buffer
and Pad (for die pad) and Pin. The [Component] subparameters for Si_location
and Timing_location only provide Die and Pin options. A Buffer option is
needed along with the rule that without the Interconnect Modeling keywords, Die
and Buffer are at the same location.
I understand that with the new interconnect/package BIRD we can basically plot
three different
nodes, pin, pad, buffer, but what is the practical need to be able to plot at
the pad and/or the
buffer? In other words, when and why would an SI engineer want to see the
waveform at the
pad or the buffer. Do they really need to be able to look at either one?
Thanks,
Arpad
===========================================================================
From: ibis-bounce@xxxxxxxxxxxxx [mailto:ibis-bounce@xxxxxxxxxxxxx] On Behalf Of ;
Mike LaBonte
Sent: Wednesday, June 28, 2017 11:53 AM
To: ibis@xxxxxxxxxxxxx
Subject: [ibis] BIRD 191, Adding Buffer Location to Si_location and
Timing_location
BIRD 191, Adding Buffer Location to Si_location and
Timing_location<http://ibis.org/birds/bird191.docx>, has been submitted by Bob
Ross of Teraspeed Labs. It will be introduced as a new BIRD in the next IBIS
Open Forum teleconference.
ID#
Issue Title
Requester
Date
Submitted
191
Adding Buffer Location to Si_location and
Timing_location<http://ibis.org/birds/bird191.docx>
Bob Ross, Teraspeed Labs
June 28, 2017
Mike LaBonte
SiSoft
Chair, IBIS Open Forum
http://www.ibis.org/
