Minutes from the 12 July 2017 IBIS Interconnect Task group meeting are attached.
Regards,
Justin
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IBIS INTERCONNECT TASK GROUP
http://www.ibis.org/interconnect_wip/ ;
Mailing list: ibis-interconnect@xxxxxxxxxxxxx
Archives at //www.freelists.org/archive/ibis-interconn/ ;
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Attendees from July 12 Meeting (* means attended at least using audio)
ANSYS Curtis Clark
Cadence Design Systems Bradley Brim
Cisco David Siadat
Intel Corp. Michael Mirmak*
Keysight Technologies Radek Biernacki, Ming Yan
Mentor, A Siemens Company Arpad Muranyi*
Micron Technology Justin Butterfield*, Randy Wolff
SAE ITC Maureen Lemankiewicz, Logen Johnson
Signal Integrity Software Walter Katz*, Mike LaBonte*
Teraspeed Labs Bob Ross*
University of Aveiro in Portugal Wael Dghais
Michael Mirmak convened the meeting. No patents were declared.
Justin Butterfield took minutes.
Review of Minutes:
- Michael called for review of the minutes from the April 26 meeting.
Mike LaBonte moved to approve the minutes. Arpad Muranyi seconded.
The minutes were approved without objection.
Review of ARs:
- Michael to submit BIRD 189.3 and BIRD 186 with the approved changes to the
IBIS Open Forum.
- Michael reported this was done.
Opens:
- None
BIRD189.5 draft 1:
Arpad shared BIRD189.5 draft 1 with changes suggested by Mike and himself. Mike
noted that the comments for this group to review are noted in the document
comments while simpler changes have already been made. Arpad noted that these
were simple language issues and typos which were corrected.
Arpad stated that in the [Bus Label] description some language was added to
clarify the bus_label names. He noted that the word "terminal" was incorrectly
used in this definition, since terminals are already defined in the subcircuit
model. Arpad mentioned there was also a question about the meaning of the
sentence "A bus_label may be defined also by the [Pin Mapping] keywords." He
commented that bus_label is not explicitly defined in the IBIS specification
already.
Arpad commented that in the Rules of Precedence section he added that [External
Circuit] and [Node Declarations] are mutually exclusive. Bob Ross asked since
[External Circuit] requires [Node Declarations], if this is redundant. Mike
commented that the parser would not flag [External Circuit] without [Node
Declarations] as an error. Arpad stated that his intent is that we need to
explicitly exclude using [Node Declarations] from being used with [Interconnect
Model]s.
Mike noted on page 10 the word "interface" is used referring to the connection
locations, but this does not line up with the diagram. The word "location" is
used instead. Arpad also noted that the phrase "interconnect rail" in this
section did not make sense. Michael stated that the reason the word "interface"
was used was to refer to the node between two sections of interconnect. Arpad
commented that the main issue he has with this section is with the use of the
word "terminals" which is used incorrectly to refer to nodes. Mike noted that
terminals refers to the external connection points of a subcircuit, while nodes
refers to the connection points of the circuit. Mike proposed to use the phase
"interface location". Arpad clarified that he does not have an issue with the
word "interface".
Mike asked about the phrase "silicon die". Arpad thought just the word "die"
should be sufficient. Michael agreed.
Arpad suggested to delete the list of Interconnect Model Set possibilities on
page 11. Bob agreed.
On page 17, Bob suggested to delete the word "or" in the last bullet item.
On page 18, Arpad noted that the references to currents have been removed and
the paragraph now focuses on the definition of voltage.
Mike commented on page 18 that the word "integer" is incorrectly used for the
unused port impedance. Bob suggested to replace "integer" with "numeric
argument greater than zero" in this section.
Arpad stated that on page 19 the term "GND" should be clarified.
Arpad noted that on page 25 the word "name" was add to the die pad, pin, buffer
terminal rules.
Arpad noted in Example 4 the file names for the touchstone file names were
reversed for die and package. Arpad also asked about the VSS for the reference
on this example. Mike suggested to take up this topic next time. Bob also
noticed that pad_name should be changed to pin_name in the first part of the
example.
Michael mentioned he will not be able to host the meeting next week. He
suggested that a draft 2 be issued and sent to the reflector, then we can review
the items that need to be reviewed.
Mike moved to adjourn. Arpad seconded. The meeting adjourned without
objection.
