[SI-LIST] Re: via ?

Nimish Aggarwal  Wrote:

> Hi
 > I am new to this list. Can you tell me how  to model > via for signal =

>  integrity analysis in a multilayer boards.
 .

> Regards
> Nimish
>
>

Dear Nimish:

When learning about modeling of vias for high-speed
simulations, one recommended reading is Chapter 5
of the "High-Speed Digital System Design A handbook
of Interconnect Theory And Design Practices" by Stephen H. Hall et al.  =
The authors illustrate that the=20
most common type of via (e.g. through-hole)  can be=20
modeled as a pi LC network and furnish simple
formulas for calculating the via capacitance and=20
inductance. =20

One merit of such analytical approach to via modeling=20
is capability to obtain a quick solution.   On the other
hand, the formulas for calculating via capacitance and
inductance involve certain approximations.  Subsequently, when aiming =
for higher accuracy  it is desirable to apply a field solver approach =
for modeling
the via.

Best Regards,

Abe Riazi
ServerWorks







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