[SI-LIST] Re: power planes (4-layer-board)

Hi, 

do you know any rule of thumb for the maximal size of such an power island 
versus the signal frequency / signal rise (fall) time? Only a default example: 
power island with one dimension in x direction of 12cm has a bare-board 
resonance of approximately 244MHz; which max rise time / signal frequency 
should the signal have? 


David, could you please tell me the reasons for the restrictions for the 
stripline calculation (http://emclab.mst.edu/pcbtlc2/stripline.html)? 
W/(H-T) < 0.35; T/H <0.25;

best regards
Daniel

 

> Daniel, as you propose this will work very well.  It avoids injecting 
> return current into a high impedance power cavity which can become an 
> EMI / SI / PI nightmare.  Just be sure to stitch the GND shapes on layer 
> 3 well to layer 2 and manage the impedances and isolation as needed of 
> your power islands.
> 
> Steve.
> Daniel Bauer wrote:
> > Hi, 
> >
> > the standard layout for an 4-layer PCB is, using outer layers for the 
> > signals and the two inner layers for one ground and one power plane. The 
> > power plane seems to have a few advantages as well as disadvantages (using 
> > an 4-layer board). 
> >
> > If a trace running at the top layer has to change to the bottom layer - 
> > also the return current has to change the layer (using stitched 
> > capacitors). 
> >
> > What do you think about the proposal to use the third layer for ground as 
> > well as for power? On every position where an signal trace is running at 
> > the bottom layer, the third layer will be a ground plane, connected to the 
> > ground plane on the second layer.... and when there`s no trace on the 
> > bottom layer I will use an power plane on the third layer.  From this it 
> > follows that I will get some power islands on the third layer which were 
> > connected with traces on the bottom or top layer.  The complete return 
> > current should use the ground plane (which has an lower impedance) and not 
> > one of the small power islands. 
> >
> > Would there be an impedance change for the signal traces changing the layer 
> > (top to bottom or vica versa) when both inner layers will use an ground 
> > plane where the signal is running? 
> >
> >
> > x----------|                      (top layer - signal layer)
> >     GND   |   GND            (second layer is a complete ground plane)
> > Power    |   GND            (ground and power islands)
> >               |---------x         (bottom layer - signal layer)
> >
> > The line will show a signal trace changing from the top to the bottom 
> > layer. Both ground planes using at the inner layers, will be connected 
> > together by many vias. Could you tell me if this would be a good decision 
> > improving signal integrity? Are there any kind of disadvantages?
> >
> >
> > best regards
> > Daniel  
> >     
> >
> >
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