[SI-LIST] Re: patent opportunity
- From: steve weir <weirsi@xxxxxxxxxx>
- To: "ron@xxxxxxxxxxx" <ron@xxxxxxxxxxx>
- Date: Sun, 30 Mar 2008 23:38:40 -0700
Ron, I recall the presentation that you gave at the HCA meeting several
years back. I am traveling this week, but you can probably reach me by
cell Tuesday or Thursday and we can kick around some ideas.
Regards,
Steve.
ron@xxxxxxxxxxx wrote:
>
> Guys
>
> I am looking for a partner in a patent pending for a printed circuit
> board fabrication technique
> that uses air dielectric to improve the speed.
>
> I need help with
>
> * fees to keep the patent alive.
> * patent conpletion
> * Promotion to the PCB engineering community
> * production financing
>
> I have lab test results that show that it works.
>
> Any gamblers out there?
>
> Ron Miller
>
>
--
Steve Weir
Teraspeed Consulting Group LLC
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- References:
- [SI-LIST] patent opportunity
- From: ron@xxxxxxxxxxx
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- From: ron@xxxxxxxxxxx