[SI-LIST] (no subject)
- From: "Rudy Q" <rudy_boy@xxxxxxx>
- To: <si-list@xxxxxxxxxxxxx>
- Date: Sat, 27 Sep 2003 22:11:37 -0700
Hi Gurus,
I am new to this field. We have the following layers in a land grid array
package:
Seal Ring
GND Layer
Signal Layer
VCCI Layer
Signal Layer
GND Layer / Die Attach
Signal Routing
VCCI Layer
VCC Layer
LGA
A driver usually draws power from the capacitance between VCCI and GND during
0-1 transition and dumps power to the GNDI plane during 1-0 transition.
|
Chip Side | Package side
|
|
VCC VCCI | VCCI plane
| | |
Driver ---Driver----------Transmission.Line (trace).
| | |
GND GND | GND plane
|
VCCI supplies the IO ring while VCC supplies the chip's core voltage. Do I need
to add another GND plane to make the package better. Any suggestion regarding a
new stack up is welcome
Thanks,
Rudy
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