[SI-LIST] digital core model

Hi all,
I want to do System in Package modeling. The SiP is laminate based,
and consists of several active silicon dies. What kind of model should I use
for those active dies? Should I use transistor-level model? or should I use
the current profile information? or just a simple norton equivalent core
model?

Anyone could give me an idea? or perhaps refer some papers or books?

thanks a lot,
Saoer


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