[SI-LIST] Re: currnet through wire bond: correction
- From: dgun@xxxxxxxxxx
- To: si-list@xxxxxxxxxxxxx
- Date: Fri, 17 Feb 2006 17:14:28 -0800
A couple of corrections in my hastily written earlier post...
The length of the bond was 4mm, not 0.4mm, and I should have
used mA-mm as another si-lister pointed out. (mA/mm would mean
that the longer the wire the better the current handling!)
This results in 1.2A-mm for 0.7 mil gold wire. BUT, see below...
I found my reference based on measured data for fusing current
and discovered that it's linear on a log-log plot! So you can't
just scale my data point linearly, but need to involve an
exponent.
--
Daniel
> dgun@xxxxxxxxxx wrote:
> Depends on the material, diameter, and length. A year or so ago, I thi=
nk I =3D
> remember
> someone posting a document to this list that covered this subject pretty =
th=3D
> oroughly.
> Try searching the archives.
>=20
> For a quick data point, I've fried 0.7 mil diameter gold wire bonds that =
we=3D
> re 0.4 mm
> long with 300 mA of current. So 750 mA/mm for 0.7 mil gold bond. No warra=
nty
> expressed or implied...
>=20
> I have a more accurate number somewhere, but I'm sure a web search can fi=
nd=3D
> it for
> you quicker than me looking through the junk on my desk.
>=20
> --
> Daniel
>=20
> > ----- Original Message -----
> > From: "Kamran Azizi" To: si-list@xxxxxxxxxxxxx
> > Subject: [SI-LIST] currnet through wire bond
> > Date: Thu, 9 Feb 2006 14:45:47 -0800 (PST)
> > =3D20
> > =3D20
> > Question: what is the current handling of wire bonds? any equations for=
t=3D
> hat. What is the=3D20
> > maximum current a wire bond can tolerate?
> > =3D20
> > thank you
> > Kami
--=20
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