HI We are designing an electro-optical element for infiniband optical transceiver. We are using a driver as a dye chip with wire bonding process. The 1 mil wire is 1mm long. One side of the dye chip is using 2 wires for differential input and on the other side we use 1 wire surrounded with 2 GND wires for signal. Our devices are design to work at baud rate of 5Gbps. I tried to get information on the web about signal integrity for high speed wire bond without any success. 1. Where can I find material about SI for wire bonding? 2. how shall I define wire bond in simulation? shall I defied it as inductor? 3. How shall I calculate the impedance of the wire bonding? 4. Are there cases were wire bond can be neglect due to the fact that it place right after the driver or right before the receiver? Thanks in advance David __________________________________________________ Do You Yahoo!? Tired of spam? Yahoo! Mail has the best spam protection around http://mail.yahoo.com ------------------------------------------------------------------ To unsubscribe from si-list: si-list-request@xxxxxxxxxxxxx with 'unsubscribe' in the Subject field or to administer your membership from a web page, go to: //www.freelists.org/webpage/si-list For help: si-list-request@xxxxxxxxxxxxx with 'help' in the Subject field List FAQ wiki page is located at: http://si-list.org/wiki/wiki.pl?Si-List_FAQ List technical documents are available at: http://www.si-list.org List archives are viewable at: //www.freelists.org/archives/si-list or at our remote archives: http://groups.yahoo.com/group/si-list/messages Old (prior to June 6, 2001) list archives are viewable at: http://www.qsl.net/wb6tpu