[SI-LIST] What is better more balls or more via ?

Hi,
I'm designing a small chip.
The inner balls (via) will be 30mil pitch.
I have place to 12BGA/20Via or 20BGA/12Via.
(using LDI 1mm 6L PCB / 16mil via / small ball ~11mil).

What do you thing is recommended for better power delivery and thermal?

Thanks,
Motti

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