[SI-LIST] What is better more balls or more via ?

  • From: "Haller, Motti" <motti.haller@xxxxxxxxx>
  • To: "'si-list@xxxxxxxxxxxxx'" <si-list@xxxxxxxxxxxxx>
  • Date: Tue, 28 Dec 2010 09:25:57 +0200

I'm designing a small chip.
The inner balls (via) will be 30mil pitch.
I have place to 12BGA/20Via or 20BGA/12Via.
(using LDI 1mm 6L PCB / 16mil via / small ball ~11mil).

What do you thing is recommended for better power delivery and thermal?


Intel Israel (74) Limited

This e-mail and any attachments may contain confidential material for
the sole use of the intended recipient(s). Any review or distribution
by others is strictly prohibited. If you are not the intended
recipient, please contact the sender and delete all copies.

To unsubscribe from si-list:
si-list-request@xxxxxxxxxxxxx with 'unsubscribe' in the Subject field

or to administer your membership from a web page, go to:

For help:
si-list-request@xxxxxxxxxxxxx with 'help' in the Subject field

List technical documents are available at:

List archives are viewable at:     
Old (prior to June 6, 2001) list archives are viewable at:

Other related posts: