[SI-LIST] Via-In-Pad or Via-Next-To-Pad - which is best?

Which has the minuimum inductance for a decoupling cap:

1.  Blind via-in-pad with via diameter of 0.15mm finished, 
    extending from layers 1 to 5 in a 6-layer board, OR
    
2.  Tracking to an immediately-adjacent 0.7mm pad, 0.3mm 
    finished blind via,extending from layers 1 to 5 in a 6-layer 
    board?
    
Many thanks,
    
-- 
JP Nicholls  /  jpnicholls@xxxxxxxx
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