[SI-LIST] Via Structure
- From: "Filion, Marc-Andre" <marc-andre.filion@xxxxxxxxxxxxxx>
- To: <si-list@xxxxxxxxxxxxx>
- Date: Thu, 19 Apr 2012 10:15:04 -0400
Hi,
We had a funny surprise when we received the bare pcb of a prototype. The PCB
fab changed the via pad from a typical round shape to an enlarged square one.
It tickle our mind and came to a quick conclusion that it won't affect much the
signal integrity.
My question here is: Is this a more effective way to build PCB (in term of
yield)? Is there any pitfall related to this technique?
best regards,
Marc-André Filion, Eng | Hardware designer | Kontron Canada | T 450 437 5682
x2243 | E marc-andre.filion@xxxxxxxxxxxxxx
<mailto:marc-andre.filion@xxxxxxxxxxxxxx>
Kontron Canada Inc
4555 Rue Ambroise-Lafortune
Boisbriand (Québec) J7H 0A4
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