[SI-LIST] Teraspeed at DesignCon

For those who will be at DesignCon this year, we hope that you have the 
opportunity to attend one of the papers or TecForums we are presenting.

 

http://www.designcon.com/2009/attendees/schedule/1_tf_ma_4.asp

Fixturing and Calibration Techniques for Obtaining Wide 
Bandwidth-Measured Data for Time Domain Simulations and 
Measurement-Based Modeling
Monday, February 2 | 9:00 am -- 12:00 pm

Heidi Barnes, Senior Consultant, Semiconductor Test Systems, Verigy
Fangyi Rao, Agilent Technologies
Tom Dagostino, Vice President, Device Modeling Division, Teraspeed
Sanjeev Gupta, Signal Integrity Applications Expert, Agilent Technologies
Al Neves, Senior Signal Integrity Engineer, Teraspeed
Mike Resso, Signal Integrity Applications Expert, Agilent Technologies
Bob Schaefer, R&D Project Manager, Agilent Technologies

 The simple oscilloscope measurement techniques of the past are clearly 
struggling with the transmission-line effects of multi-gigabit data 
rates that are now commonplace in consumer products. The ability to 
accurately measure the performance of an electrical component is 
critical for guaranteeing its performance as a sub-element in a larger 
system or for improving the accuracy of system simulations and 
measurement-based models. This tutorial will focus on the practical side 
of understanding calibration techniques for obtaining wide-bandwidth 
data that is viable for use in time domain simulations and 
measurement-based modeling.


http://www.designcon.com/2009/attendees/schedule/12_wa_1.asp
Measurement-Assisted Electromagnetic Extraction of Interconnect 
Parameters on Low-Cost FR--4 boards for 6--20 Gbps Applications
 Wednesday, February 4 | 8:30 am -- 9:10 am


Yuriy Shlepnev, President, Simberian
Alfred Neves, Senior Staff Signal Integrity Engineer, Teraspeed 
Consulting Group
Tom Dagostino, Vice President Engineering, Teraspeed Labs
Scott McMorrow, President, Teraspeed Consulting

The presentation unites interconnect analysis and measure-based 
verification implementing advanced TRL/LRM calibration along with 
conditioning of the de-embedded S-parameters. We show practical test 
cases on a FR4 board to 1 percent correspondence between full-wave 
modeling and measurements. A test board with 30 test structures has been 
fabricated and investigated experimentally and numerically over the 
frequency band from 300 KHz to 20 GHz. To identify properties of the 
materials, transmission line segments and resonant structures are used. 
Broadband dielectric models are extracted by comparison of experimental 
data with results of 3D full wave.



 http://www.designcon.com/2009/attendees/schedule/10_th_2.asp
 PCB Power Delivery Optimizations for the Cost-Driven Era
Thursday, February 5 | 9:50 am -- 10:30 am

Steve Weir, Member Technical Staff, Teraspeed Consulting Group/IPBLOX
Tom Dagostino, Vice President, Device Modeling Group, Teraspeed 
Consulting Group
 
PCB--level power delivery involves choices in PCB laminates, 
construction, bypass capacitor selection, and placement. We examine 
currently available choices as they apply to realizing high-performance 
power delivery while optimizing manufactured cost. We demonstrate 
results using test vehicles built with current-generation ICs.





-- 
Scott McMorrow
Teraspeed Consulting Group LLC
121 North River Drive
Narragansett, RI 02882
(401) 284-1827 Business
(401) 284-1840 Fax

http://www.teraspeed.com

Teraspeed® is the registered service mark of
Teraspeed Consulting Group LLC



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