I?m have a chip that I?ve done some analysis on to get its driver impedance. However this chip is on a substrate board, and it?s drivers run through traces to balls and to the board. I have R, L, and C numbers for the trace/bondwire combination as part of a package model that was made by someone else. The trace in question is ½ inch long and the frequency of interest is 350Mhz. I?ve made the assumption that I can use vector addition to add the inductive and resistive contributions together, but I don?t know what to do with the capacitive part. I?m also assuming that once I?ve vector added the inductive, resistive, and capacitive parts together for a total Zpackage that I can then linearly add Zpackage and the Zdriver from previous experiments. Does that seem right? I?m just a little confused on the appropriate steps to take. As always I appreciate the time you all take to read and respond to my questions. Thanks, Eric Steimle ------------------------------------------------------------------ To unsubscribe from si-list: si-list-request@xxxxxxxxxxxxx with 'unsubscribe' in the Subject field or to administer your membership from a web page, go to: http://www.freelists.org/webpage/si-list For help: si-list-request@xxxxxxxxxxxxx with 'help' in the Subject field List FAQ wiki page is located at: http://si-list.org/wiki/wiki.pl?Si-List_FAQ List technical documents are available at: http://www.si-list.org List archives are viewable at: http://www.freelists.org/archives/si-list or at our remote archives: http://groups.yahoo.com/group/si-list/messages Old (prior to June 6, 2001) list archives are viewable at: http://www.qsl.net/wb6tpu