[SI-LIST] Re: Spacing rules for reduction of cross talk
- From: "Nicklas" <nicklas@xxxxxxxxx>
- To: <kedar@xxxxxxxxxxxxxxxxx>, <si-list@xxxxxxxxxxxxx>
- Date: Thu, 6 Jan 2005 11:38:24 -0500
Hi Kedar,
Adding to previous speakers on this topic, a good parametric plotting visual
aid for the effects of varying the PCB height, trace width and trace pitch,
and dielectric materials as a function of both impedance and crosstalk can
be found at this link: http://www.interactive-products.com/IFSPro_Parms.htm
The visual tool bar shows plot trends for each of these behaviors, and is a
good visual intuition development aid.
Following are a couple of examples or illustrations that can be found at the
link, of impedance and cross talk interdependencies.
- If you increase the conductor width, the impedance will decrease, and the
cross talk increases.
- If you increase the conductor pitch (conductor width + separation), the
impedance increases and ultimately asymptotes (levels off) as the cross talk
decreases as a result of the decoupling of the conductors.
- If you decrease the dielectric height with regards to ground you decrease
the impedance and decrease the crosstalk.
Cheers.
Nicklas
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