[SI-LIST] Re: Skin Effect, Au, and Cu
- From: John Barnes <jrbarnes@xxxxxxxxx>
- To: richard.moffat@xxxxxxxxxxxxxxxxxxx, si-list@xxxxxxxxxxxxx
- Date: Wed, 23 Feb 2005 10:14:31 -0500
Richard,
Here is an article that you may want to check out:
Bayes, Martin, and Horn, Al,
"Effects of conductor surface condition on signal integrity,"
<CITE>Circuit World</CITE>, vol. 30 no. 3, pp. xx, 2004. <P>
It discusses the effects of surface roughness, electroless nickel (Ni-P)
finish, immersion tin (Sn) finish, and PWB foil adhesion treatments on
conductor dissipative losses up to 14GHz.
I ran across it by accident last night, while doing research at the
University of Kentucky Engineering Library for my web pages on designing
electronics to be lead-free, RoHS-compliant, and WEEE-compliant (
http://www.dbicorporation.com/rohsbib.htm
http://www.dbicorporation.com/rohs.htm )
to supplement my books which were published last year (Robust Electronic
Design Reference Book, VOlumes 1 and 2,
http://www.dbicorporation.com/book-out.htm )
Enjoy!
John Barnes KS4GL, PE, NCE, ESDC Eng, PSE, SM IEEE
dBi Corporation
http://www.dbicorporation.com/
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- [SI-LIST] Skin Effect, Au, and Cu
- From: richard moffat
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- [SI-LIST] Skin Effect, Au, and Cu
- From: richard moffat