[SI-LIST] Scattering parameters for "typical" vias
- From: Stefan Ludwig <ludwig@xxxxxxxxxxxxxxxxx>
- To: si-list@xxxxxxxxxxxxx
- Date: Wed, 12 Nov 2003 21:23:54 +0100
Hi,
does anybody know of a place where one can get
scattering parameters (s2p files) for "typical" vias
used in current FR-4-based PCBs? By typical I mean
max. of 1:10 ratio (drill hole size vs. PCB thickness)
vias.
I know that there are many variables involved, like
number of power planes, pad sizes, through-hole vs.
back-drilled vs. buried vs. laser, etc., so any
pointers would be appreciated.
Unfortunately, I don't have a 3D solver at hand, with
which I could model this.
Thanks!
Stefan
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