[SI-LIST] SPI 2006 - Deadline Extension

Please consider the following announcement and accept our apologies in case
of multiple copies.

<******************>       SUBMISSION       <******************>
<******************>   DEADLINE EXTENSION   <******************>
<******************>   February 15th, 2006   <******************>

At the request of a great many of potential authors we have decided to
extend the deadline for paper submission. New deadline is now February 15,
2006. Accordingly the notification about acceptance will be moved to March
28, 2006.

<****************************************************************>



Call for Papers
10th IEEE WORKSHOP ON
SIGNAL PROPAGATION ON INTERCONNECTS

Sponsored by the IEEE Computer Society -- Test Technology Technical Council 
(TTTC)
and by the IEEE Components, Packaging, and Manufacturing Technology (CPMT) 
Society

May 09-12, 2006
Dorint Sofitel Schweizerhof Berlin, Berlin-Mitte, Germany

http://www.spi.uni-hannover.de


Deadlines 
- Paper Submission: February 15, 2006 
- Notification of Acceptance: March 28, 2006 

Paper Submission 
Those who wish to contribute to the workshop should send (by e-mail only) a 
formatted paper of up to four pages to the Program Chair by January 31, 2006 
(please see the submission instructions on our website 
http://www.spi.uni-hannover.de and use the author's kit provided there to 
ensure a consistent layout). If the paper is accepted, it will be reproduced, 
as is, in the workshop proceedings. Notification about acceptance will be given 
by March 14, 2006. 

Main topics of the workshop will include, but are not limited to: 
- Frequency Domain Measurement Techniques 
- Time Domain Measurement Techniques 
- Modeling Techniques of Package & On-Chip Interconnects 
- Macro-Modeling 
- Simulation Techniques for Interconnect Structures 
- Electromagnetic Field Theory 
- Analysis and Modeling of Power Distribution Networks 
- Propagation Characteristics on Transmission Lines 
- Coupling Effects on Interconnects 
- Substrate Effects 
- Guided Waves on Interconnects 
- Radiation & Interference 
- Electromagnetic Compatibility 
- Power/Ground-Noise 
- Testing & Interconnects 
- Optical Interconnects 


Workshop Standing Committee: 
Flavio G. Canavero, Politecnico di Torino, Dipartimento di Elettronica, Torino 
(I); 
canavero@xxxxxxxxx 

Hartmut Grabinski, Univ. Hannover, Laboratorium fuer Informationstechnologie, 
Hannover (D); 
grabinski@xxxxxxxxxxxxxxxxxxx 

Michel S. Nakhla, Carleton University, Department of Electronics, Ottawa (CAN); 
msn@xxxxxxxxxxxxxxx 

Jose E. Schutt-Aine, Univ. of Illinois at Urbana-Champaign, Center for Comp. 
Elm., Urbana (USA); 
jose@xxxxxxxxxxxxxx 

Madhavan Swaminathan, 
Georgia Institute of Technology, 
Atlanta (USA); 
madhavan.swaminathan@xxxxxxxxxxxxxx 

Chair: 
Hartmut Grabinski, Laboratorium fuer Informationstechnologie, Schneiderberg 32, 
30167 Hannover (Germany) Phone +49-511-762-5030; Fax +49-511-762-5051 
grabinski@xxxxxxxxxxxxxxxxxxx 

Program-Chair: 
Uwe Arz, Physikalisch-Technische Bundesanstalt, On-Wafer Microwave Measurements 
(2.23), Bundesallee 100, 38116 Braunschweig (Germany) Phone +49-531-592-2297; 
Fax +49-531-592-2228  
uwe.arz@xxxxxx 


Technical Program Committee: 
R. Abhari, Univ.McGill (Ca)
T.R. Arabi, Intel (USA)
W. Bandurski, Univ. Poznan (PL)
A. Cangellaris, Univ. Illinois (USA)
J.L. Carbonero, ST (F)
E. Chiprout, Intel (USA)
D. Deschacht, Univ. Montpellier II (F)
A. Deutsch, IBM (USA)
T. Dhaene, Univ. of Antwerp (B)
E. Griese, Univ. Siegen (D)
H.-J. John, Siemens VDO Automotive AG (D)
R. Khazaka, Univ.McGill (Ca)
G. Katopis, IBM, Poughkeepsie (USA)
I. Maio, Politecnico di Torino, Torino (I)
J. Niehof, Philips Research Laboratories (NL)
P. Nordholz, Infineon, Munich (D)
N. van der Meijs, Univ. Delft (NL)
H.J. Pfleiderer, Univ. Ulm (D)
J.L. Prince, Univ. of Arizona, Tucson (USA)
B. Ross, Teraspeed Consulting Group, (USA)
A. Rubio, Univ. UPC Barcelona (E)
A.E. Ruehli, IBM, Yorktown Heights (USA)
E. Sicard, INSA, Toulouse (F)
G. Sommer, Fraunhofer IZM, Berlin (D)
A. Weisshaar, Oregon State Univ. (USA)
T.M. Winkel, IBM, Boeblingen (D)

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