[SI-LIST] SPI 2003 1st announcement

Please consider the following announcement and accept our apologies in case 
of multiple copies.


                         CALL FOR PARTICIPATION


                          7th IEEE WORKSHOP ON

                  SIGNAL PROPAGATION ON INTERCONNECTS
                              Sponsored by
    the IEEE Computer Society - Test Technology Technical Council (TTTC)
                                 and by
   the IEEE Components, Packaging, and Manufacturing Technology (CPMT) Society


                             May 11-14, 2003
                      "Hotel Garden" Siena, Italy

                     http://www.spi.uni-hannover.de

Deadlines
  -Paper Submission: March 2, 2003
  -Notification of Acceptance: March 31, 2003
  -Guaranteed hotel reservations: April 5, 2003
  -Advance registration: April 14, 2003

Paper Submission
Perspective Authors should send (by e-mail only) a formatted two-page or 
four-page paper to the Program Co-Chair by March 2, 2003 (please see the 
submission instruction on our website http://www.spi.uni-hannover.de).
If the paper is accepted, it will be reproduced, as is, in the workshop 
proceedings.

The workshop covers the areas of interconnections and packaging modeling, 
simulation, design, measurement and testing at chip, board, and system levels.
It includes but is not limited to the following topics:
- Delta-I Noise
- Broadband Measurement Techniques and Theory
- Coupling Effects on Interconnects
- Determination of Characteristic Parameters
- Field Theory
- Ground Bounce
- Guided Waves on Interconnects
- Measurement, Modeling, and Simulation of Package Interconnects
- Non-Linear Modeling and Analysis
- Propagation Characteristics on Signal and Ground Lines
- Radiation and Interference
- Simulation Techniques for 2- and 3-dimensional Interconnect Structures
- Substrate Influence on Signal Propagation
- Interconnects and Testing
- Mixed Signal Test
- Optical Interconnects: Design and Test

Workshop Standing Committee:

Joachim P. Mucha, Univ. Hannover, Institut fur Theoret. Elektrotechnik, 
Hannover (D), mucha@xxxxxxxxxxxxxxxxxxx

Flavio G. Canavero, Politecnico di Torino, Dipartimento di Elettronica, 
Torino (I)
canavero@xxxxxxxxx

Hartmut Grabinski, Universitat Hannover, Institut fur Theoretische 
Elektrotechnik, Hannover (D) grabinski@xxxxxxxxxxxxxxxxxxx

Michel S. Nakhla, Carleton University, Department of Electronics, Ottawa (CAN)
msn@xxxxxxxxxxxxxxx

Jose E. Schutt-Aine, Univ. of Illinois at Urbana-Champaign, Center for 
Comp. Elm., Urbana (USA) jose@xxxxxxxxxxxxxxxxxx

Madavan Swaminathan, Georgia Institute of Technology, Atlanta (USA) 
madhavan.swaminathan@xxxxxxxxxxxxxx

Technical Program Committee:

R. Aschenbrenner, Fraunhofer IZM, Berlin (D)
W. Bandurski, Univ. Poznan (PL)
A. Cangellaris, Univ. Illinois (USA)
J.L. Carbonero, ST (F)
E. Chiprout, Intel (USA)
D. Deschacht, Univ. Montpellier II (F)
H. Dirks, Univ. Kiel (D)
E. Griese, Univ. Siegen (D)
H.-J. John, Siemens AG, Paderborn (D)
E. Kuh, Univ. of Calif., Berkeley (USA)
N. van der Meijs, Univ. Delft (NL)
O.A. Palusinski, Univ. Arizona, Tucson (USA)
H.J. Pfleiderer, Univ. Ulm (D)
L.T. Pileggi, Carnegie Mellon, Pittsb. (USA)
J.L. Prince, Univ. of Arizona, Tucson (USA)
K. Reis, Univ. Karlsruhe (D)
A. Rubio, Univ. UPC Barcelona (E)
A.E. Ruehli, IBM, Yorktown Heights (USA)
E. Sicard, INSA, Toulouse (F)
T.W. Williams, Synopsys, Mount. View (USA)

Chair:
Flavio G. Canavero,
Politecnico di Torino,
Dipartimento di Elettronica,
Corso Duca Abruzzi 24, I-10129 Torino (Italy)
Tel. +39-011-564-4060, Fax +39-011-564-4099
e-mail canavero@xxxxxxxxx

Program Co-Chair:
Ivan A. Maio,
Politecnico di Torino,
Dipartimento di Elettronica,
Corso Duca Abruzzi 24, I-10129 Torino (Italy)
Tel. +39-011-564-4100, Fax +39-011-564-4099
e-mail maio@xxxxxxxxx

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