[SI-LIST] SI and FAE engineer openings
- From: John Lehman <john.lehman@xxxxxxxxxxxxxxxx>
- To: si-list@xxxxxxxxxxxxx
- Date: Wed, 20 Jun 2007 08:36:24 -0400
Amphenol-TCS has open positions for Signal Integrity Engineers in New
Hampshire and Singapore, Beijing, Shanghai, and Taiwan..
Job Description: These positions are responsible for design,
simulation, characterization, and application of high speed electric=
al
connectors, backplane systems and cable-based interconnect. The
candidate would be part of an established team of dedicated signal
integrity engineers who are responsible for both component developme=
nt
as well as customer support on new product introduction.
Requirements: The candidate should have experience with signal integ=
rity
and simulation tools such as Ansoft HFSS, CST Microwave, HSPICE, Mat=
Lab,
and ADS. The candidate should also have hands-on experience with
frequency-domain and time-domain component and circuit characterizat=
ion
including understanding of test methods and calibration methods.
BS/MS/PhD in EE with at least 5 years of industry experience is
required. Experience in component design and application of high sp=
eed
connectors into communications equipment is a plus.
Amphenol-TCS also has openings for Field Applications Engineers in
California, Singapore, Taiwan, Beijing and Shanghai. The role will
involve using our expertise in designing high speed data links to se=
ll
our latest generation products.
Job Description:
=B7 Helping customers across a wide range of sectors solving their =
high
speed data transmission problems
=B7 Helping the internal Sales Engineers to develop strategies for
product break-in at existing and new accounts based on our SI expert=
ise
=B7 Participating with customer design teams in developing new high=
speed
circuit and interconnect designs across a wide range of product type=
s
=B7 Providing market and customer feedback to the internal Product
Development Team to be used on new product designs
Experience across the following is desirable:
=B7 Circuit and PCB layout, EM understanding, Signal Integrity issu=
es in
PCB layout, HSPICE, Matlab, TDR and VNA measurement
=B7 A level of system level design or understanding would be a bonu=
s
Please email john.lehman@xxxxxxxxxxxxxxxx for additional information=
in
these positions.=
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