[SI-LIST] Re: Reminder on CIE-SF 2007 Annual Short Course, EPMC02, Electrical and Thermal issues in Electronic Packaging this coming Saturday at SJSU

Hi All,

This is a reminder that CIE-SF 2007 Annual Short Course, EPMC-02, Electrical
and Thermal issues in Electronic Packaging will be held on this coming
Saturday (09/29) afternoon, at San Jose State University.

This EPMC-02 class will be presented by Dr. An-Yu Kuo, who is CTO and
co-founder of Optimal Corporation in San Jose, California.  He received his
BS, MS, and PhD from National Tsing-Hua University, National Taiwan
University, and University of Illinois at Urbana-Champaign, respectively.
Dr. Kuo is main technical expertise in physics-based simulation with the
finite element method.   Dr. Kuo has been actively involved in signal/power
integrity and thermal/mechanical simulation of IC packages during the last
15 years.  His recent R&D activities are in the areas of chip-package-PCB
co-simulation, thermal-power co-simulation, and high-speed/RF simulation.

CIE-SF EPMC and Co-sponsor San Jose State University announce the year 2007
Annual Short Courses.  Four 3-hour technical presentations are scheduled
focusing on electrical packaging introduction, package electrical and
thermal considerations, system in package design flow and applications, and
the latest development in high performance lead frame packaging and
applications.  Courses will be presented by industry experts.  Both
introductory and in-depth technical aspects will be addressed.  The classes
will be held from September 22nd to October 13th, 2007, every Saturday
afternoon from 1:30 pm to 4:30 pm at San Jose State University, Engineering
Building, room 339.  Registration starts from 1:00 pm.

The schedule of the short courses is:
Course No:
        Course Topics
        Speaker
        Date

EPMC01
        Introduction to Electronic Packaging
        Dr. Andy Tseng
        09/22/2007

EPMC02
        Electrical and Thermal issues in Electronic Packaging
        Dr. An-Yu Kuo
        09/29/2007

EPMC03  
        System in Package (SIP) Design Flow and Applications
        Mr. Shawn Nikoukary
        10/06/2007

EPMC04  
        Latest Development in High Performance Lead-Frame Packaging and
Applications
        Dr. Weiping Li
        10/13/2007

Fees:   Free to San Jose State University students/faculties
        Free to Santa Clara University students
        For CIE members, $20 for each class, $60 for entire course
        For non-CIE members, $25 for each class, $80 for entire course

Note:   CIE annual membership fee is $20.  By signing up for all 4 classes,
you will get 1 year of CIE membership for free.  CIE life time membership
fee is $100.

Pre-registration is highly recommended.  Please email to
cie_shortcourse2007@xxxxxxxxx with your name and email address.  Thanks.

Location: San Jose State University, Engineering Building (located on San
Fernando St. between 7th and 8th street)
Map: http://www.sjsu.edu/about_sjsu/docs/SJSU_campus_map.pdf
Free parking is available during weekends at Fourth St. Garage, 44 South
Fourth St., at San Fernando St. across from Dr. Martin Luther King, Jr.
Library

2007 CIE-SF Short Course Organizing Committee

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