[SI-LIST] Re: Rembrandt versus Art Barn

Steve,

Well put.


> [Original Message]
> From: steve weir <weirsi@xxxxxxxxxx>
> To: Joel Brown <joel@xxxxxxxxxx>
> Cc: <olaney@xxxxxxxx>; <Sol.Tatlow@xxxxxxxxxxxxxxxxxxxx>;
<si-list@xxxxxxxxxxxxx>
> Date: 4/8/2009 5:20:14 PM
> Subject: [SI-LIST] Re: Rembrandt versus Art Barn
>
> Joel, it's certainly the exception rather than the rule.   Intel, and 
> IBM both provide adequate information at least for certain ICs.  Altera 
> is getting pretty close.  I expect they will be there sometime in 2009.  
> I am hoping to get there sometime this year with certain chips from
Micron.
>
> If a manufacturer provides impedance versus frequency profile for power 
> impedance ( ideally both magnitude and phase ), and a specification for 
> noise sensitivity, then you can do your job.  The first and most 
> embarrassing question that I think should be directed at each and every 
> apps dept is:  "What metrics are your PDN recommendations based on?"  
> The corollary question to every sales rep who comes in the door should 
> be:  "I am very interested in using your chip.  I won't be able to do 
> that without basic power delivery metrics.  I might consider your chip 
> without that information if your company will indemnify us for any 
> losses we suffer due to PDN related problems with your chip."
>
> Many times yes, the PDN recommendations from a chip supplier are total 
> junk built as assumptions on top of assumptions on top of assumptions. 
>
> The "you might just be a redneck if..." is an old schtick of the 
> comedian Jeff Foxworthy.  For instance:  "If you go to family reunions 
> looking for dates, then you might just be a redneck."
>
> My fear for the industry is that sooner or later the barracudas with 
> briefcases will see the $400 billion per year IC industry and realize 
> that from a legal standpoint they can readily show that most PDNs are 
> designed negligently.  In most cases, no one from the IC manufacturer to 
> the OEM can typically show any analysis that the power system is 
> actually going to work reliably.  All they need is some automobile with 
> Microsoft Vista Embedded Defect Edition, or one of those Skytanic 380s 
> to be involved in one or a series of crashes and it's going to be a 
> combination of the tobacco and ADA shakedown lawsuits all over again.
>
> Best Regards,
>
>
> Steve.
>
> Joel Brown wrote:
> > Steve,
> >
> > I have yet to encounter an IC manufacturer that will give the
information
> > you stated below. If you know of any can you please list them? In
absence of
> > such information how could one not at least consider manufacturer
> > recommendations of bypass capacitor and ferrite bead configurations?
> > Are you saying those recommendations are mostly wrong and worthless?
> > We would all like to design a PDN intelligently and knowing all the
> > parameters of the IC, pcb, capacitors and ferrites but I am afraid that
is
> > not real world and in the end we have to make our best guess. I also do
not
> > understand your use of the term redneck but I don't consider myself one
so
> > it does not offend me either.
> >
> > Joel
> >
> >
> > -----Original Message-----
> > From: si-list-bounce@xxxxxxxxxxxxx
[mailto:si-list-bounce@xxxxxxxxxxxxx] On
> > Behalf Of steve weir
> > Sent: Wednesday, April 08, 2009 3:38 PM
> > To: olaney@xxxxxxxx
> > Cc: Sol.Tatlow@xxxxxxxxxxxxxxxxxxxx; si-list@xxxxxxxxxxxxx
> > Subject: [SI-LIST] Re: Rembrandt versus Art Barn
> >
> > Ferrites can be incredibly useful tools.  More often than not I see
them 
> > used inappropriately where they do little or no good and introduce
nasty 
> > side effects. 
> >
> > With my apologies to Jeff Foxworthy:
> >
> > If your IC manufacturer won't tell you the required power rail
impedance 
> > versus frequency at the IC mounting pads, the IC manufacturer might
just 
> > be a redneck.
> >
> > If your IC manufacturer says place some number of bypass capacitors per 
> > power pin, the IC manufacturer might just be a redneck.
> >
> > If your IC manufacturer tells you to use a certain bypass network 
> > without regard to capacitor placement, mounting method, or PCB
stack-up, 
> > the IC manufacturer might just be a redneck.
> >
> > If your IC manufacturer tells you to put special features in your PCB 
> > like moats without specifying the numeric parameters driving that, the 
> > IC manufacturer might just be a redneck.
> >
> > If your IC manufacturer tells you to add reactive elements like ferrite 
> > beads without specifying the network frequency response, the IC 
> > manufacturer might just be a redneck.
> >
> > If your IC manufacturer insists that you have to use particular 
> > practices like a linear regulator, but won't tell you the noise 
> > susceptibility of their IC, the IC manufacturer might just be a redneck.
> >
> > If you blindly follow advice from an IC manufacturer without getting 
> > metrics, you might just be a redneck.
> >
> >
> >
> > olaney@xxxxxxxx wrote:
> >   
> >> Perhaps the supplier knows the chip better than anyone else, but when
it
> >> comes to putting it on PCB and making it play well with others... let's
> >> just say that silicon designers often aren't SI or EMC experts by a
long
> >> shot.  I've spent enough time showing semi manufacturers their mistakes
> >> and suggesting improvements that I never take a demo board at face
value.
> >>  Some are empirically tweaked beyond all reason to make them work, and
> >> sometimes I wonder what they were smoking (a ferrite bead in series
with
> >> the ground pin of an IC???).  Playing monkey see, monkey do with these
> >> layouts can get you into real trouble.  Others are clearly works of
> >> scientific art that I study carefully to see what I can learn.  GaAs
> >> designers seem to have the knack.  
> >>
> >> The expertise to tell Rembrandt from Art Barn when studying a suggested
> >> layout is not in everybody's kit bag.  I'd be curious to hear the ways
> >> that others distinguish one from the other.  One I use is the
observation
> >> that a classic response to inadequate understanding is an attempt to
> >> compensate through overdesign.  The result is lots more components in
the
> >> schematic than experience says should be necessary.
> >>
> >> Orin Laney
> >>  
> >> On Wed, 08 Apr 2009 18:47:26 +0200 Sol Tatlow
> >> <Sol.Tatlow@xxxxxxxxxxxxxxxxxxxx> writes:
> >>   
> >>     
> >>> Steve, thanks, finally, for an answer.
> >>>
> >>> As to why one would want to do this, it's very simple:
> >>> when the chip manufacturer recommends you do something that
> >>> goes against what you believe is right.
> >>>
> >>> Theoretically, he should know his chip better then anyone
> >>> else (right?!?), and the application note should be there
> >>> to help 'real-life' engineers implement the chip with
> >>> minimal effort. Trouble is, experience tells me this is
> >>> often not the case, as you already confirmed, like, I guess,
> >>> many others could.
> >>>
> >>> The 2 variant 'trick' covers you with minimal risks and
> >>> costs. This is exactly why I did it in the past, and in all
> >>> 3 cases, I was vindicated. Simple, and painless, and not
> >>> really a science experiment at all, with all due respect.
> >>>
> >>> My aim is pretty much the same as yours, I think, to get
> >>> customers' designs realised as best I can, and I believe
> >>> that in some cases, the 2 variant trick is a handy 'tool' -
> >>> granted, not in every case, perhaps, but certainly sometimes.
> >>>
> >>> Sol
> >>>
> >>>
> >>> steve weir schrieb:
> >>>     
> >>>       
> >>>> Sol, no and aside from a burning desire to conduct science 
> >>>>       
> >>>>         
> >>> experiments
> >>>     
> >>>       
> >>>> I don't know why anyone else would.
> >>>> I don't what is more real life than real physics.  The experiment 
> >>>>       
> >>>>         
> >>> I
> >>>     
> >>>       
> >>>> proposed to Lee can be implemented as the one panel experiment you 
> >>>>       
> >>>>         
> >>> seek.
> >>>     
> >>>       
> >>>> Steve.
> >>>> Sol Tatlow wrote:
> >>>>       
> >>>>         
> >>>>> Steve, Charles, thanks for taking time to respond - your comments
> >>>>> are all clear and understood... but you still haven't answered 
> >>>>>         
> >>>>>           
> >>> the
> >>>     
> >>>       
> >>>>> question, or rather, given any real-life examples!
> >>>>>
> >>>>> Let me rephrase the question once more - and this is not just for
> >>>>> you, but for all of those 3,500 people out there who are 
> >>>>>         
> >>>>>           
> >>> subscribed
> >>>     
> >>>       
> >>>>> to this list, of whom so few responded:
> >>>>>
> >>>>> Have you ever had 2 variants of the same layout manufactured on 
> >>>>>         
> >>>>>           
> >>> the
> >>>     
> >>>       
> >>>>> same panel, where the only difference between the two is that one
> >>>>> has a solid ground plane, and the other has some form of moating
> >>>>> and/or ferrite (or otherwise) isolated ground islands, where one 
> >>>>>         
> >>>>>           
> >>> of
> >>>     
> >>>       
> >>>>> the variants could be indisputably shown to perform better, with
> >>>>> respect either to functionality or EMI? If so, which one?
> >>>>>
> >>>>> There... that's hopefully now in a form where anyone can easily 
> >>>>>         
> >>>>>           
> >>> and
> >>>     
> >>>       
> >>>>> quickly give a more or less simple 'yes' or 'no' answer ;)!!!
> >>>>>
> >>>>> Sol
> >>>>>
> >>>>> P.S. Troublingly, it seems that a lot of the emails on this 
> >>>>>         
> >>>>>           
> >>> subject
> >>>     
> >>>       
> >>>>> haven't even reached me... so, sorry if I didn't respond to 
> >>>>>         
> >>>>>           
> >>> anyone,
> >>>     
> >>>       
> >>>>> assume in that case I didn't get the mail, and try sending it 
> >>>>>         
> >>>>>           
> >>> again.
> >>>     
> >>>       
> >>>>> (yes, I looked in the 'spam' folder - no sign of them there 
> >>>>>         
> >>>>>           
> >>> either)
> >>>     
> >>>       
> >>>>> steve weir schrieb:
> >>>>>  
> >>>>>         
> >>>>>           
> >>>>>> Sol there are too many variables to give you a single answer or 
> >>>>>>           
> >>>>>>             
> >>> a
> >>>     
> >>>       
> >>>>>> simple closed formula.  If we have enough distance to work with 
> >>>>>>           
> >>>>>>             
> >>> we can
> >>>     
> >>>       
> >>>>>> obtain arbitrary isolation.  Moating comes into play when the 
> >>>>>>           
> >>>>>>             
> >>> amount
> >>>     
> >>>       
> >>>>>> of distance we have to work with is insufficient.  For anything 
> >>>>>>           
> >>>>>>             
> >>> more
> >>>     
> >>>       
> >>>>>> complicated than the kind of simple demonstration I proposed one 
> >>>>>>           
> >>>>>>             
> >>> is
> >>>     
> >>>       
> >>>>>> stuck doing the engineering work.  If you are looking for a 
> >>>>>>           
> >>>>>>             
> >>> benchmark,
> >>>     
> >>>       
> >>>>>> a crude one that I can offer is that if you need more than 60dB
> >>>>>> isolation, you should be questioning whether this can be 
> >>>>>>           
> >>>>>>             
> >>> packaged
> >>>     
> >>>       
> >>>>>> compactly without a split.
> >>>>>>
> >>>>>> Your comments about vagueries in appnotes is well founded.  
> >>>>>>           
> >>>>>>             
> >>> There is
> >>>     
> >>>       
> >>>>>> no substitute for doing the actual engineering.
> >>>>>>
> >>>>>> Steve.
> >>>>>> Sol Tatlow wrote:
> >>>>>>    
> >>>>>>           
> >>>>>>             
> >>>>>>> Steve, no question, I understand and agree. Actually, I was 
> >>>>>>>             
> >>>>>>>               
> >>> hoping
> >>>     
> >>>       
> >>>>>>> for some real-life examples of when moating (or ferrite 
> >>>>>>>             
> >>>>>>>               
> >>> connected
> >>>     
> >>>       
> >>>>>>> analog/digital grounds) really has been more or less PROVEN to 
> >>>>>>>             
> >>>>>>>               
> >>> be
> >>>     
> >>>       
> >>>>>>> a necessary and good idea... and preferably not just eval 
> >>>>>>>             
> >>>>>>>               
> >>> boards,
> >>>     
> >>>       
> >>>>>>> but 'proper' boards.
> >>>>>>>
> >>>>>>> As I said, I don't expect a full dissection of anybody's 
> >>>>>>>             
> >>>>>>>               
> >>> private
> >>>     
> >>>       
> >>>>>>> work - it would be something if I could just hear from a 
> >>>>>>>             
> >>>>>>>               
> >>> handful
> >>>     
> >>>       
> >>>>>>> of people that they had 2 variants of the same board made at 
> >>>>>>>             
> >>>>>>>               
> >>> the
> >>>     
> >>>       
> >>>>>>> same time, on the same panel, one with a split ground, and one 
> >>>>>>>             
> >>>>>>>               
> >>> with
> >>>     
> >>>       
> >>>>>>> a solid ground, where it was found that one was better (in 
> >>>>>>>             
> >>>>>>>               
> >>> whatever
> >>>     
> >>>       
> >>>>>>> way) than the other.
> >>>>>>>
> >>>>>>> It's a simple technique, but my suspicion is that noone is 
> >>>>>>>             
> >>>>>>>               
> >>> going to
> >>>     
> >>>       
> >>>>>>> be able to give me a good CONCRETE case FOR a ground split,
> >>>>>>> particularly not with regards to EMI... although I would love 
> >>>>>>>             
> >>>>>>>               
> >>> to be
> >>>     
> >>>       
> >>>>>>> proved wrong, to know 100% certain that all those painstaking
> >>>>>>> efforts I have made in the past on so many boards with split 
> >>>>>>>             
> >>>>>>>               
> >>> planes
> >>>     
> >>>       
> >>>>>>> really were necessary :)!
> >>>>>>>
> >>>>>>> Of course, producing and assembling 2 variants of the same 
> >>>>>>>             
> >>>>>>>               
> >>> board is
> >>>     
> >>>       
> >>>>>>> coupled with higher costs; particularly with prototypes, I can 
> >>>>>>>             
> >>>>>>>               
> >>> also
> >>>     
> >>>       
> >>>>>>> understand why people, if they only have 5 good chips, don't 
> >>>>>>>             
> >>>>>>>               
> >>> want
> >>>     
> >>>       
> >>>>>>> to 'risk' even one of them in this way.
> >>>>>>>
> >>>>>>> Nevertheless, it really irks me to have to follow some app note
> >>>>>>> which seems to have little to do with the real world, simply
> >>>>>>> because everyone in the design chain was/is too worried of 
> >>>>>>>             
> >>>>>>>               
> >>> having
> >>>     
> >>>       
> >>>>>>> problems... kind of "Well, the last chip we did was on an eval
> >>>>>>> board with a split plane, and THAT worked, so let's do it the 
> >>>>>>>             
> >>>>>>>               
> >>> same
> >>>     
> >>>       
> >>>>>>> way again", the main target being that the eval board looks 
> >>>>>>>             
> >>>>>>>               
> >>> great
> >>>     
> >>>       
> >>>>>>> and the chip performs perfectly!
> >>>>>>>
> >>>>>>> So, let me reformulate my original question:
> >>>>>>>
> >>>>>>> Have you any real-life examples where the correct use of 
> >>>>>>>             
> >>>>>>>               
> >>> moating
> >>>     
> >>>       
> >>>>>>> or split DGND/AGND planes (as opposed to one solid ground) on 
> >>>>>>>             
> >>>>>>>               
> >>> an
> >>>     
> >>>       
> >>>>>>> otherwise well placed and routed board, was 100% shown to "make 
> >>>>>>>             
> >>>>>>>               
> >>> or
> >>>     
> >>>       
> >>>>>>> break" a product? A simple "no" is of course also a good answer 
> >>>>>>>             
> >>>>>>>               
> >>> :)!
> >>>     
> >>>       
> >>>>>>> Sol
> >>>>>>>
> >>>>>>>
> >>>>>>> steve weir schrieb:
> >>>>>>>  
> >>>>>>>      
> >>>>>>>             
> >>>>>>>               
> >>>>>>>> Sol, unfortunately there is not a single answer.  In most 
> >>>>>>>>               
> >>>>>>>>                 
> >>> cases
> >>>     
> >>>       
> >>>>>>>> moating is a bad idea, particularly if one does not understand 
> >>>>>>>>               
> >>>>>>>>                 
> >>> the
> >>>     
> >>>       
> >>>>>>>> caveats and how to deal with them.  It's not just the moats:  
> >>>>>>>>               
> >>>>>>>>                 
> >>> It's
> >>>     
> >>>       
> >>>>>>>> the
> >>>>>>>> placement, clearances, stitching, and routing that all need to 
> >>>>>>>>               
> >>>>>>>>                 
> >>> be
> >>>     
> >>>       
> >>>>>>>> considered.
> >>>>>>>>
> >>>>>>>> Steve
> >>>>>>>>
> >>>>>>>> Sol Tatlow wrote:
> >>>>>>>>           
> >>>>>>>>               
> >>>>>>>>                 
> >>>>>>>>> I know this subject has been raised before, countless times 
> >>>>>>>>>                 
> >>>>>>>>>                   
> >>> in one
> >>>     
> >>>       
> >>>>>>>>> guise or another. I have also googled plenty. I'm not looking 
> >>>>>>>>>                 
> >>>>>>>>>                   
> >>> for
> >>>     
> >>>       
> >>>>>>>>> theoretical opinions, either, about whether or not, or when, 
> >>>>>>>>>                 
> >>>>>>>>>                   
> >>> they
> >>>     
> >>>       
> >>>>>>>>> should be used (specifically not, "it depends", unless you've 
> >>>>>>>>>                 
> >>>>>>>>>                   
> >>> got
> >>>     
> >>>       
> >>>>>>>>> REAL-LIFE examples, for and against!!!).
> >>>>>>>>>
> >>>>>>>>> This subject raised its head for me in this case due to using
> >>>>>>>>> 2 A/Ds as well as 2 D/As, both from Analog Devices, where one
> >>>>>>>>> specifies a split plane, the other specifies no split. Now, I 
> >>>>>>>>>                 
> >>>>>>>>>                   
> >>> am
> >>>     
> >>>       
> >>>>>>>>> all too wary of relying simply on evaluation boards, where, 
> >>>>>>>>>                 
> >>>>>>>>>                   
> >>> in
> >>>     
> >>>       
> >>>>>>>>> general, one layout is done, and if it works, that's how 
> >>>>>>>>>                 
> >>>>>>>>>                   
> >>> everyone
> >>>     
> >>>       
> >>>>>>>>> should do it (_without_ comparing 2 different approaches).
> >>>>>>>>>
> >>>>>>>>> I personally have 3 concrete cases where split gnds had no 
> >>>>>>>>>                 
> >>>>>>>>>                   
> >>> positive
> >>>     
> >>>       
> >>>>>>>>> effect on SI, but significantly worsened EMC results (despite
> >>>>>>>>> sticking to all the usual guidelines, like no tracks over the
> >>>>>>>>> splits, etc.), but I have no concrete case FOR split ground 
> >>>>>>>>>                 
> >>>>>>>>>                   
> >>> planes.
> >>>     
> >>>       
> >>>>>>>>> So, what I'm interested in is: does anyone have CONCRETE 
> >>>>>>>>>                 
> >>>>>>>>>                   
> >>> examples
> >>>     
> >>>       
> >>>>>>>>> which they would like to share for/against split planes? The 
> >>>>>>>>>                 
> >>>>>>>>>                   
> >>> kind
> >>>     
> >>>       
> >>>>>>>>> of thing I mean would be like in one of the cases I had, where 
> >>>>>>>>>                 
> >>>>>>>>>                   
> >>> I
> >>>     
> >>>       
> >>>>>>>>> wanted to go against the suggested approach of using a split 
> >>>>>>>>>                 
> >>>>>>>>>                   
> >>> gnd,
> >>>     
> >>>       
> >>>>>>>>> and persuaded my customer to pay for 2 variants of the same 
> >>>>>>>>>                 
> >>>>>>>>>                   
> >>> board
> >>>     
> >>>       
> >>>>>>>>> on the same manufacturing panel, one with split ground, one 
> >>>>>>>>>                 
> >>>>>>>>>                   
> >>> with
> >>>     
> >>>       
> >>>>>>>>> solid ground. Both variants were assembled and tested, with 
> >>>>>>>>>                 
> >>>>>>>>>                   
> >>> regards
> >>>     
> >>>       
> >>>>>>>>> to both SI as well as EMC: both were functionally 
> >>>>>>>>>                 
> >>>>>>>>>                   
> >>> satisfactory; at
> >>>     
> >>>       
> >>>>>>>>> EMC testing, however, the split-plane bombed out big time, 
> >>>>>>>>>                 
> >>>>>>>>>                   
> >>> while
> >>>     
> >>>       
> >>>>>>>>> the non-split sailed through. I like to think that it wasn't 
> >>>>>>>>>                 
> >>>>>>>>>                   
> >>> due
> >>>     
> >>>       
> >>>>>>>>> to any screw-ups on my side, that the split ground failed - I 
> >>>>>>>>>                 
> >>>>>>>>>                   
> >>> am
> >>>     
> >>>       
> >>>>>>>>> not a newbie to PCB layouts, and, while for sure no 
> >>>>>>>>>                 
> >>>>>>>>>                   
> >>> professional
> >>>     
> >>>       
> >>>>>>>>> expert on all areas of SI, I believe I avoided the typical 
> >>>>>>>>>                 
> >>>>>>>>>                   
> >>> blunders
> >>>     
> >>>       
> >>>>>>>>> often present in split ground layouts.
> >>>>>>>>>
> >>>>>>>>> Anyway, my customer was more than happy, but not everyone has 
> >>>>>>>>>                 
> >>>>>>>>>                   
> >>> the
> >>>     
> >>>       
> >>>>>>>>> money/time/desire to do as I suggested. So, any 'war stories' 
> >>>>>>>>>                 
> >>>>>>>>>                   
> >>> to
> >>>     
> >>>       
> >>>>>>>>> support one or the other approach would be appreciated to 
> >>>>>>>>>                 
> >>>>>>>>>                   
> >>> help
> >>>     
> >>>       
> >>>>>>>>> expand my knowledge and understanding of this subject - 
> >>>>>>>>>                 
> >>>>>>>>>                   
> >>> obviously,
> >>>     
> >>>       
> >>>>>>>>> we all respect confidentiality, so I'm not looking for 
> >>>>>>>>>                 
> >>>>>>>>>                   
> >>> circuits,
> >>>     
> >>>       
> >>>>>>>>> layouts and so on, but I figure many of you must have stories 
> >>>>>>>>>                 
> >>>>>>>>>                   
> >>> that
> >>>     
> >>>       
> >>>>>>>>> can be related regarding this subject. Or perhaps some good 
> >>>>>>>>>                 
> >>>>>>>>>                   
> >>> links
> >>>     
> >>>       
> >>>>>>>>> to non-confidential 'real-life' examples/studies?
> >>>>>>>>>
> >>>>>>>>> Regards,
> >>>>>>>>> Sol
> >>>>>>>>>
> >>>>>>>>>                   
> >>>>>>>>>                 
> >>>>>>>>>                   
> >>>>>>>>             
> >>>>>>>>               
> >>>>>>>>                 
> >>>>>>>         
> >>>>>>>             
> >>>>>>>               
> >>>>>>     
> >>>>>>           
> >>>>>>             
> >>>>>   
> >>>>>         
> >>>>>           
> >>>>       
> >>>>         
> >>> -- 
> >>> ________________________________________
> >>>
> >>> Sol Tatlow, M. Eng. (Oxon)
> >>> Product Developer
> >>>
> >>> Pro Design Electronic GmbH
> >>> Albert-Mayer-Str. 16
> >>> D-83052 Bruckmuehl
> >>> Phone: +49 (0) 8062/808-302
> >>> PCFax: +49 (0) 8062/808-2302
> >>> sol.tatlow@xxxxxxxxxxxxxxxxxxxx
> >>> www.prodesign-europe.com
> >>> ________________________________________
> >>>
> >>> Vertretungsberechtigte Geschaeftsfuehrer:
> >>> Helmut Mahr, Ulrike Angersbach, Stephan Roeslmair, Dieter Lessenich
> >>>
> >>> Registergericht: Amtsgericht Traunstein  Registernummer: HRB 13 002
> >>>
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> -- 
> Steve Weir
> Teraspeed Consulting Group LLC 
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