[SI-LIST] Regulator Heat dissipation

Hi All,
How effective is the heat dissipation by the LT1764AF (or similar devices
from Linear Tech) through the metalic tab attached to its case which is
soldered to the PCB?

In my design, i am connecting this tab (hence the case of Regulator) to a Cu
fill on the top layer, which covers the Regulator area. The Cu fill is
connected to 4 GND planes (4 internal layers) using through hole vias. In
effect the heat is transferred to the internal planes. How effective will be
the heat transfer from the internal planes to the environment?

Please note that the heat disspated is around 100 deg C above the ambient
and 40 deg above the rated junction temp.

regards,
NAND.




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