[SI-LIST] Re: ROHS 6/6 BGA device in Non-ROHS reflow

  • From: "Sachin Nalbalwar" <sachin.nalbalwar@xxxxxxxxxxxxxxxxx>
  • To: <si-list@xxxxxxxxxxxxx>
  • Date: Thu, 14 Oct 2010 19:10:57 +0530

Thanks Tom, I have posted query at SMTnet.
 
Regards,
Sachin Nalbalwar
        -----Original Message-----
        From: tom bleakley [mailto:tebleakley@xxxxxxxxx] 
        Sent: Thursday, October 14, 2010 6:26 PM
        To: Sachin Nalbalwar
        Cc: si-list@xxxxxxxxxxxxx
        Subject: Re: [SI-LIST] ROHS 6/6 BGA device in Non-ROHS reflow
        
        
        Sachin,
        You may want to post your question to the forum on SMTnet.com. 
        Lots of SMT experts there.
        tom
        
        On Wed, Oct 13, 2010 at 7:16 AM, Sachin Nalbalwar
<sachin.nalbalwar@xxxxxxxxxxxxxxxxx> wrote:
        

                Hi All,
                  Is there any way to use ROHS6/6 [Non-leaded] BGA
device in Non-ROHS
                reflow [240 Deg C] temp. environment.
                
                I need to do this because Leaded [ROHS5/6] device I was
using is
                obsolete and Non-leaded[ROHS6/6] drop-in-replacement
part is available
                now.
                
                
                One way out I am thinking is, not sure if it is correct
or not. -
                
                Can we use non-leaded solder paste/solder cream for
soldering this
                Non-leaded[ROHS6/6] on board?
                Because of lower temp. [240 Deg.C] this
Non-leaded[ROHS6/6] device balls
                may not melt but non-leaded solder paste will help.
                
                
                I am sorry if you feel this query is not relevant in
this forum.
                
                
                Regards,
                Sachin Nalbalwar
        
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