[SI-LIST] Re: ROHS

,
    Great paper from Dr Johnson, of course.  If only Tin whiskers
    were the end of it.

    I believe an issue that will turn up sooner is Cu dissolution.
    Besides a propensity to grow whiskers, tin is more corrosive
    without lead to passivate it.  The PC board industry is seeing
    plated through holes losing copper through the LF soldering
    process.  Not good.

    Just last week I had the pleasure of hosting a panel at the end
    of the Global Conference on Lead-Free Reliability in Boston. We
    called it "The War of the RoHS's" as the name was too fitting.
    Sorry I did not announce here, this list hadn't shown interest.
    In this forum I always lean toward preserving signal/noise <g>.

    Short version: For *decades* we've optimized every aspect of
    electronics production around eutectic solder.  Therefore every
    material, chemical and specification involved will need to work
    in a new environment.

-- 

 
      Jeff Seeger                         Applied CAD Knowledge Inc
      Chief Technical Officer                  Tyngsboro, MA  01879
      jseeger "at" appliedcad "dot" com                978 649 9800

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