[SI-LIST] Re: ROHS

I'm not too sure about TWs yet. I'm having too many other issues related
to RoHS!
1) Procuring parts: Expensive, and LONG! lead times, if you CAN get them.
2) Amount of time required to properly profile the reflow for lead-free.
With the extra heat, assemblers have to be EXTRA careful to profile
accordingly (size of board, size of panel, size of component --> then,
next time doing it the same, but the board size has changed) Not nearly as
simple as leaded assembly. I've had a lot of delamination becuase
assemblers rushed things like they could with leaded assemblies.
3) I'll only go immersion gold plated. Too much fear of 'untested' plating
methods between suppliers. $$$
Need I go on? Good thing my boards are mostly enigineering reference
boards...

Good day.
Mitch
>
> A quick poll / question: Has anyone recently had problems relating to
> tin whiskers from the non-leaded solder?
>
>
> Leonard Dieguez



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