[SI-LIST] R: AW: 8 layer stackup recommandation
- From: <gianguida@xxxxxxxx>
- To: "Havermann, Gert" <Gert.Havermann@xxxxxxxxxxx>, Mustafa Özgür TUTUM <mustafa.tutum@xxxxxxxxxxxxx>, <si-list@xxxxxxxxxxxxx>
- Date: Fri, 19 Sep 2008 13:37:12 +0200
Dear Gert,
there is a direct connection between a good SI practice and a good EMC-PCB
design.
Just to make an easy example, it is simple to see that the reduction of ripple
on a fast signal ( using approppriate termination load) will produce a
reduction of the field radiated by the net.
In general good SI practive is the first step (not the only one) towards a good
EMC design.
Giancarlo
________________________________
Da: si-list-bounce@xxxxxxxxxxxxx per conto di Havermann, Gert
Inviato: ven 19/09/2008 11.15
A: Mustafa Özgür TUTUM; si-list@xxxxxxxxxxxxx
Oggetto: [SI-LIST] AW: 8 layer stackup recommandation
Mustafa,
Is it correct that your first stackup has two signal layers between Power and
GND? Does that mean your routing broadside coupled? If not, I think you will
have a very hard time routing that to be sure that your GND-return paths are
all correct. Even with broadside coupling you need to be very careful when
using the Power plane as GND-return path. I recommend the second stackup to
avoid hidden errors in your design.
I've never seen a reliable relationship between good SI- and good EMC- PCB
designs. You can have both, but you can not rely on getting good EMC
performance just by careful selecting Stackup and routing. A good Stack and
routing does at least assure that your high speed lines will be resistant to EM.
BR
Gert
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-----Ursprüngliche Nachricht-----
Von: si-list-bounce@xxxxxxxxxxxxx [mailto:si-list-bounce@xxxxxxxxxxxxx] Im
Auftrag von Mustafa Özgür TUTUM
Gesendet: Freitag, 19. September 2008 10:52
An: si-list@xxxxxxxxxxxxx
Betreff: [SI-LIST] 8 layer stackup recommandation
Dear all, I have 2 questions
1) We are planning to use 8 layer PCB for high speed circuit having max 1.5GHz
clock frequency. Which stackup do you recommend?
First Stackup:
Signal
Ground
Signal
Signal (includes a few power islands)
Power (includes ground island for 4th layers' high speed signals' return path)
Signal
Ground
Signal
OR
Second Stackup:
Signal
Ground
Signal
Ground
Power
Signal
Ground
Signal
Second choice seems good but very hard for routing, Do you think it worths to
try second choice?
Which is the best stack up for 8 layer PCB for good Signal integrity and EMC
performance?
2) Can we say that if any stackup is the best for Signal Integrtiy, it is also
the best for EMC? or reverse?
Thanks for your interest
Regards
Mustafa
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