[SI-LIST] Re: Question regarding thermal layers
- From: Alan Hilton-Nickel <AHilton@xxxxxxxxxx>
- To: "'si-list@xxxxxxxxxxxxx'" <si-list@xxxxxxxxxxxxx>
- Date: Mon, 11 Aug 2003 10:29:51 -0700
Dennis,
This is the second time in about a week that someone has suggested using
"thermal" layers in addition to 'ground" layers. I responded to the last one
suggesting they use the thermal layers as ground, but maybe I'm missing
something. What is is it that makes you feel that a sheet of copper that you
are using to conduct heat cannot also do the job of conducting current?
Alan Hilton-Nickel
NVIDIA Corp,
Santa Clara, CA
> -----Original Message-----
> From: Dennis Tomlinson [mailto:det_werks@xxxxxxxxxxxxx]
> Sent: Sunday, August 10, 2003 4:27 AM
> To: si-list@xxxxxxxxxxxxx
> Subject: [SI-LIST] Question regarding thermal layers
>
>
> I am designing a conductin cooled module which will employ
> thermal layers in the stackup and underfill on selected
> devices. The thermal layers are DC isolated from circuit
> ground. I am proposing the following stackup:
>
> 1. Signal + Comps
>
> 2. Thermal
>
> 3. Ground
>
> 4. Signal
>
> 5. Signal
>
> 6. Ground
>
> 7. Signal + Area Fills (1.8V, +5V)
>
> 8. Signal + Area Fills (-5V, 2.5V)
>
> 9. Power (3.3V)
>
> 10. Signal
>
> 11. Signal
>
> 12 Ground
>
> 13. Thermal
>
> 14 Signal + Comps
>
> My question is in regard to using the thermal layers as
> signal returns. The dielectric between thermal and ground
> layers is 5 mil core. I am contemplating the use of some
> strategically placed bypass caps between thermal and ground
> layers, as well as between thermal and 3.3V layers. Anyone
> care to critique or comment on this plan? Would it make sense
> to swap layers 9 (3.3V) and 12 (Ground)? Thanks in advance,
>
> Dennis Tomlinson
>
>
>
>
>
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