[SI-LIST] Re: Question about the usage of package model(.pkg) in IBIS and the [Package] parameter

Seshadri-

If the simulator you are using conforms to the IBIS specification in the way it 
handles IBIS files, then:

If matrix data from a .pkg file defined in the [Define Package Model] section 
is available, it will be used.  If not, the simulator will then try to use the 
per-pin parasitic info (R_pin, L_pin, and C_pin) defined in the [Pin] section 
if it is available. If that data is not available then the simulator will then 
utilize the data provided in the [Package] section (typ, min, and max values of 
R_pkg, L_pkg, and C_pkg).

The most detailed data available is used: [Define Package Model].pkg file data 
overrides [Pin] section data which overrides the [Package] typ/min/max data.


[Package] section data is always required to be present. Data in the [Pin] 
section is optional, as is matrix data supplied by the .pkg file data in the 
[Define Package Model] section.

Since the data in the [Package] section is not used when matrix data is 
available the values are irrelevant to the simulation as long as something is 
there.


The values provided in the [Package] section are usually determined by looking 
at the typ/min/max RLC values of all the package types a particular piece of 
silicon might be packaged in from a particular vendor. That is to say if a chip 
"Driver Array A" is available in a 400, 800 and 1000 pin BGA packages, then the 
values for the [Package] section typ/min/max RLC data are derived from the 
typ/min/max values of RLC for all 3 available packages.

-Ray

Raymond Anderson
Senior Signal Integrity Staff Engineer
Programmable Platforms Development
Silicon Technology Group
Signal Integrity and Package Development Department

Xilinx Inc.
2100 Logic Drive
San Jose, California  95124




> -----Original Message-----
> From: si-list-bounce@xxxxxxxxxxxxx [mailto:si-list-bounce@xxxxxxxxxxxxx]
> On Behalf Of Seshadri Venkataramanan
> Sent: Tuesday, March 31, 2009 9:52 AM
> To: si-list@xxxxxxxxxxxxx
> Subject: [SI-LIST] Question about the usage of package model(.pkg) in IBIS
> and the [Package] parameter
> 
> Hello all,
> 
> I have the following question regarding the usage of package models
> and the presence of Package parameters ( R_pkg, L_pkg and C_pkg).
> 
> I understand that if there is no package model available for a
> particular IBIS Model but I have the per pin package parasitic
> information, I can use the [Package] parameter to define the min,max
> and typ  R_pkg, L_pkg and C_pkg values by taking the min, max, typ
> values from the per pin parasitic info.
> and use the [Pin] keyword to define the individual pin's parasitic
> information.
> 
> But, if I have a package model that includes a sparse matrix for
> Inductance, Capacitance and Resistance separately, I use the  [Define
> Package Model] to copy the .pkg file into my IBIS and use [Package
> Model] keyword to call the package in my IBIS Model.
> 
> The question here is the [Package] keyword is mandatory and I don't
> think I can just take the min, max and typ values from the sparse
> matrix to fill the R_pkg, L_pkg and C_pkg values. What can be done in
> this case. How do I get the  [Package]  parameters for a package
> model?
> I understand we don't have to define per pin parasitics in the [Pin]
> keyword. But I am worried about the values for R_pkg, L_pkg and C_pkg
> when using a package model for my IBIS file.
> 
> I would also like to know if the package model developers can provide
> the R_pkg, L_pkg and C_pkg values to me.
> 
> Thanks a lot in advance.
> 
> --
> Seshadri Venkataramanan
> 
> Graduate Student
> MS - Electrical Engineering
>  ( Mixed Signal Circuit Design) / Student Design Intern.
> Arizona State University/ NXP Semiconductors.
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