[SI-LIST] Re: PDS analysis?
- From: "Bowden, Ivor" <ibowden@xxxxxxxxxxxxxxxxx>
- To: "Dan Smith" <Dan.Smith@xxxxxxxxx>, <si-list@xxxxxxxxxxxxx>
- Date: Fri, 28 Mar 2008 18:11:46 -0700
Dan,
Thank you for your reply. I know there have been studies contrasting lower
value caps with via inductance. Are there cases, with adjacent thin dielectric
power - gnd stickups, where changing 0.1uF ceramic bypass caps to lower values
solved cases of dysfunctional operation?
-Ivor
-----Original Message-----
From: Dan Smith [mailto:Dan.Smith@xxxxxxxxx]
Sent: Friday, March 28, 2008 8:56 AM
To: Bowden, Ivor; si-list@xxxxxxxxxxxxx
Subject: RE: PDS analysis?
Ivor,
With what you described below there could be problems. These problems would be
manifested as noise ripple on your VCC planes which will eat into your margins
budget for Vih and Vil of your devices. By placing only 0.1uf capacitors and
no other values, you have only minimized your noise on your power planes at
about 10mhz.
You can never eliminate your parallel resonance but adding additional
capacitors will lower the overall inductance of the mounting capacitors which
(when intersected with your plane capacitor) will lower the impedance holes
somewhat and move them out higher in frequency. But again, they will never be
eliminated.
You should use more capacitor values for sure.
Dan
-----Original Message-----
From: si-list-bounce@xxxxxxxxxxxxx [mailto:si-list-bounce@xxxxxxxxxxxxx] On
Behalf Of Bowden, Ivor
Sent: Friday, March 28, 2008 7:24 AM
To: si-list@xxxxxxxxxxxxx
Subject: [SI-LIST] PDS analysis?
Hi SI Experts,
Say you have a typical PCB with modern technology mix of CPU, DSP, DDR, GIGE,
PCIE, etc. Say it is a multi-layer stackup in the form of GND-SIG-SIG-GND sets,
with the power distribution centered in the stackup as solid ground plane -
split power plane - split power plane - solid ground plane, using 1oz copper
and 3.5 mil dielectric. Assuming the split power planes utilize sufficient area
to keep the point to point inductance and resistance to reasonable values, and
0.1uF ceramic bypass caps are evenly placed at device pins, and bulk
capacitance is placed as needed, would there be reason to expect any problems,
such as plane resonance, etc? If so, what would be the observable real world
manifestations, in terms of circuit performance and power pins scope waveforms?
Would there be significant advantage to analyzing this PDS, or should following
this "industry standard practice" for PCB PDS be sufficient to expect robust
behavior?
Thanks,
Ivor Bowden
Senior Hardware Engineer
Curtiss-Wright Controls Embedded Computing
10201 Wateridge Circle
Suite 300
San Diego, CA 92121
858-452-0020 x 4405
ibowden@xxxxxxxxxxxxxxxxx
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- References:
- [SI-LIST] Re: PDS analysis?
- From: Dan Smith
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- From: Dan Smith