[SI-LIST] PCB stackup
- From: "s_aout" <s_aout@xxxxxxxx>
- To: si-list@xxxxxxxxxxxxx
- Date: Mon, 21 Feb 2005 22:02:46 -0000
Hi all,
I am working on a product which requires high shielding (no
interference with mobile pagers) and the PCB goes in plastic
enclosure (w/o metallic paint). The highest working frequency is
200Mhz and the PCB stackup is :
TOP ground
Layer1 signal + power fill 1.8V
Layer2 ground
Layer3 signal + power fill 3.3V
Layer 4 signal + power fill 5V
Layer 5 ground
Layer 6 signal + power fill 3.3V
Bottom ground
Is this stackup ok? and do you think that not having a full power
plane would be a problem?
thanks
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