[SI-LIST] Re: PCB solder current carrying capacity
- From: Scott McMorrow <scott@xxxxxxxxxxxxx>
- To: Doug Brooks <dbrooks9@xxxxxxxxxxxxxxx>
- Date: Tue, 21 Jul 2009 19:36:10 -0400
Vijaya
If you're trying to push thermal limits, you'll want to read this paper.
http://ieeexplore.ieee.org/xpl/freeabs_all.jsp?arnumber=1320488
Doug Brooks wrote:
> In one of the articles on our web site re current carrying capacity
> of traces, we include this observation (which is approximate).
> The resistivity of solder (depending on its composition) is
> approximately ten times higher than that for copper. Thus, you can
> think of the trace (pad) and solder as being two conductors in
> parallel --- one with 10x the resistance of the other (assuming
> similar widths and thicknesses.)
>
> On standard traces, we tell our customers to ignore the current
> carrying capacity of the solder and just consider the copper itself.
> Then it is determined just by the cross-sectional area of the copper.
>
> Doug Brooks
> UltraCAD
> http://www.ultracad.com
>
>
>
>
> At 11:03 AM 7/21/2009, Gumaste, Vijaylaxmi wrote:
>
>
>> Hi,
>>
>>
>>
>> I want to determine current carrying capacity of solder pads -
>> effect of solder material/ land-pad size for very high current
>> applications (>5A-10A per solder pad)
>>
>>
>>
>> I can use IPC spec to design appropriate metal layer trace
>> widths/thickness for a required temp rise.
>>
>> However, I am looking at options to estimate/calculate/simulate
>> current carrying capacity for solder pads.
>>
>>
>>
>>
>>
>> -Vijaya.
>>
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>
> Check out our resources at http://www.ultracad.com
>
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--
Scott McMorrow
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