[SI-LIST] Re: PCB STACKUP

  • From: Vinu Arumugham <vinu@xxxxxxxxx>
  • To: "'Nosovitski, Alexander (Contr)'" <alexander.nosovitski@xxxxxxx>
  • Date: Wed, 21 Jan 2004 14:43:58 -0800

What's the advantage (other than layer count) of routing DIFF_SIGNAL 
referenced to AGND and POWER_ANALOG instead of using a single stripline 
referenced to two GND or AGND planes?
Thanks,
Vinu

Chris Landrum x311 wrote:

>Alexander,
>
>I would be inclined to say you do not need the AGND planes.  Without knowing
>the intricate parts of your design, I would say that tying AGND and GND
>together at a backplane will be a BAD idea.  With the information at hand, I
>would assume you are using the AGND to somehow "benefit" the Gb/s signals.
>I would argue, that if this is the case, and you tie the AGND to GND
>together at the backplane, you could easily hurt the design especially from
>an EMI perspective, as you may induce loop currents.
>
>On another note, tt looks like you have good inner-planar capacitance built
>into the design....which is good. I would suggest that you make sure you
>have built this capacitance for all the power supplies in your design.
>Also, I notice that there are many PWR/GND plane pairs towards the center of
>the board.  If you intend these structures (the ones toward the middle
>layers) to provide inner planar capacitance, I might argue that the
>inductance of the vias used to attach the planes may be great enough to
>offset the benefit of the inner-planar capacitor.  As such, you may be able
>to get rid of some of the internal planes to save cost.  Now, if you have
>current or voltage requirements that require this many planes, then by all
>means, what you have designed is correct.
>
>Just my thoughts...for what they are worth.
>
>-----Original Message-----
>From: Nosovitski, Alexander (Contr)
>[mailto:alexander.nosovitski@xxxxxxx]
>Sent: Wednesday, January 21, 2004 4:44 PM
>To: 'Chris Landrum x311'
>Subject: RE: [SI-LIST] PCB STACKUP
>
>
>Hi Chris,
>
>Yes, AGND and GND will be tied together. 
>I am not sure yet if it is going to be at the backplane or
>at the board. 
>
>Regards,
>
>Alexander
>
>
>
>-----Original Message-----
>From: Chris Landrum x311 [mailto:clandrum@xxxxxxxxx]
>Sent: Wednesday, January 21, 2004 4:18 PM
>To: Nosovitski, Alexander (Contr); si-list@xxxxxxxxxxxxx
>Subject: RE: [SI-LIST] PCB STACKUP
>
>
>The first thing that pops out to me is whether or not the AGND and GND
>layers will all be tied together.  If not, then what is the purpose of the
>AGND layers?
>
>-----Original Message-----
>From: Nosovitski, Alexander (Contr)
>[mailto:alexander.nosovitski@xxxxxxx]
>Sent: Wednesday, January 21, 2004 4:03 PM
>To: si-list@xxxxxxxxxxxxx
>Subject: [SI-LIST] PCB STACKUP
>
>
>Hello si-list,
>
>
>The design I am working on has a dense placement.
>
>The proposed stack up looks as follow:
>
>TOP
>POWER_ANALOG
>DIFF_SIGNAL (Gb/s signals)
>AGND
>
>GND
>POWER
>S
>S
>GND
>POWER
>S
>S
>GND
>SPLIT_POWER
>GND
>S
>S
>POWER
>GND
>S
>S
>GND
>
>AGND
>DIFF_SIGNAL_ANALOG (Gb/s signals)
>POWER ANALOG
>
>BOTTOM
>
>
>
>All signal layers are 0.5 Oz copper and 
>
>All planes are solid ( except one in the middle) with  0.5 Oz copper.
>
>The diff. signals are running at 2.5Gb/s.
>
>
>There are different opinions about analog plane location.
>
>Could the arrangement above cause a problem?
>
>What else should I be concern about?
>
>
>
>Any help or suggestion is appreciated!
>
>
>Regards,
>
>Alexander Nosovitski
>
>
> 
>
>
>
>
>
>
>
>
> 
>
>-----Original Message-----
>From: Salkow, Steven [mailto:steven.salkow@xxxxxxxx]
>Sent: Wednesday, January 21, 2004 1:57 PM
>To: weirsp@xxxxxxxxxx; fred@xxxxxxxxxxxxx; kar_thik_v1@xxxxxxxxx
>Cc: si-list@xxxxxxxxxxxxx
>Subject: [SI-LIST] Re: Looking for thin dielectric tape
>
>
>4 mil prepreg (pcb laminate) is generally available from anyone doing
>multilayer PCB. You may also get samples from laminate vendors (dupont,
>Norplex) (sprayed with Scotch 444 adhesive for cold adhesion to copper
>foils)
>3M (tape division) have exactly what your looking for up to 36" wide
>slit to any width but they have minimum qtys
>
>see
>http://products3.3m.com/catalog/us/en001/utilities_telecom/oem_electrica
>l/node_R5MTBSFVGPbe/root_GST1T4S9TCgv/vroot_GSHBRQT7DVge/gvel_BBGZX3B1QG
>gl/theme_us_oemeletrical_3_0/command_AbcPageHandler/output_html
>
>Catalog on the above page for download
>
>Steve Salkow
>Lockheed Martin
>3200 Zanker Road
>San Jose, CA 95134
>(408) 473-4058 (san Jose)
>(408) 742-4162 (Sunnyvale)
>steven.salkow@xxxxxxxx
>salkow@xxxxxxxxxxxx
>(925) 462-1075 Home
>(925-) 487-5946 Cell
>(408) 468-7271 Numeric Pager
>
>-----Original Message-----
>From: si-list-bounce@xxxxxxxxxxxxx
>[mailto:si-list-bounce@xxxxxxxxxxxxx]On Behalf Of steve weir
>Sent: Tuesday, January 20, 2004 11:17 PM
>To: fred@xxxxxxxxxxxxx; kar_thik_v1@xxxxxxxxx
>Cc: si-list@xxxxxxxxxxxxx
>Subject: [SI-LIST] Re: Looking for thin dielectric tape
>
>
>If you want to lay out a board, onesy, twosy, Express PCB is not a bad
>way 
>to go.  www.expresspcb.com It sure beats the Bishop Graphics adhesive 
>backed Cu tape, or a bathroom full of ferric chloride.
>
>Steve.
>At 01:44 PM 1/20/2004 -0800, Fred Townsend wrote:
>  
>
>>The last time I check you could still get mylar sheeting at most
>>drafting and staionary stores. You would to apply your own adhesive.
>>Comes in 4 and 7 mil thicknesses. You can also get polyester sheeting
>>frosted one side and adhesive on the other for making labels.  Failing
>>that how about 3M's double sticky magic tape?
>>
>>Fred Townsend
>>
>>Karthik V wrote:
>>
>>    
>>
>>>Hello,
>>>
>>>        I am a student at the State University of New York. I am 
>>>      
>>>
>>looking for a double sided sticky dielectric tape (more like a sheet )
>>    
>>
>of 
>  
>
>>thickness about 4mils (0.1mm) and with a dielectric constant of 
>>around  4, to use between copper sheets - to make a "temporary board".
>>    
>>
>I 
>  
>
>>tried things like epoxy, but it's almost impossible to get it so thin
>>    
>>
>and 
>  
>
>>still provide infinite DC resistance.
>>    
>>
>>>         Could anyone point me to places where I could look for this
>>>      
>>>
>
>  
>
>>kind of stuff. Is there anything else I could try to get the
>>    
>>
>dielectric 
>  
>
>>(with Dk around 4) so thin ( apart from elaborate processes )   .
>>    
>>
>>>thanks in advance,
>>>Karthik,
>>>
>>>---------------------------------
>>>Do you Yahoo!?
>>>Yahoo! Hotjobs: Enter the "Signing Bonus" Sweepstakes
>>>
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