The last std cell design I worked on was 90nm and had a DDR2-533. The vendor provided a scalable model for the on-die transient and IR voltage drop. As I recall it included die and package parasitics. We added on-die I/O capacitance until we meet the vendor's release requirements (reasonable IMO) for on-die droop/noise. Don't remember what the capacitance was that we ended up with per driver, but by using a special on-die cap, we managed to get a lot more than I thought could be possible. The results looked good in the lab post-fab. In any event, I don't see how you can proceed without detailed simulations by you or your semi-vendor? best regards and good luck ------------------------------------------------------------------ To unsubscribe from si-list: si-list-request@xxxxxxxxxxxxx with 'unsubscribe' in the Subject field or to administer your membership from a web page, go to: //www.freelists.org/webpage/si-list For help: si-list-request@xxxxxxxxxxxxx with 'help' in the Subject field List technical documents are available at: http://www.si-list.net List archives are viewable at: //www.freelists.org/archives/si-list or at our remote archives: http://groups.yahoo.com/group/si-list/messages Old (prior to June 6, 2001) list archives are viewable at: http://www.qsl.net/wb6tpu