**** This employment opportunity is being directly advertised by the employer. **** National's Package Technology Group has an immediate opening for an interconnect electrical performance / signal integrity engineer focussing on IC packaging for the next generation of analog and mixed signal products. National Semiconductor is the leading analog company driving the information age. Combining real world analog and state-of-the-art digital technology, the company is focused on analog-based semiconductor products, which include stand-alone devices and subsystems in the areas of power management, portable power, display drivers, audio, amplifiers and data conversion. With headquarters in Santa Clara, National reported sales of $1.98 billion for its most recent fiscal year. Job Title: Packaging Engineer - Electrical Performance Package Technology Group, National Semiconductor Corp. Job Description: As an engineer in this position, you will be responsible for characterizing electrical performance of packages, advising product teams on package selection and pushing the envelope on speed and noise immunity on existing packaging technologies. Key Responsibilities include: Provide electrical modeling/ characterization support as part of National's advanced package technology group. Coordinate activities between modeling, circuit design teams and application engineering to provide an electrically robust packaging solution to National's IC products. Own and update the package electrical performance roadmap for Package Technology Group. Define methodologies for electrical performance modeling, and communicate these methodologies to design teams across the corporation as needed. Be a part of the research and development of future packaging technologies for National's focus on high performance analog ICs. Requirements: MS in Electrical Engineering, with a packaging focus. Candidates with MS in Mechanical / Material Science Engineering having sufficient background in Electrical Engineering will also be considered. Two to three years of experience in evaluating electrical performance of packages using simulations and measurements. Experience with RLC extraction / electromagnetic simulation tools, for example Ansoft HFSS, Sigrity SPEED, Q3D Extractor, and Agilent ADS. A background in high frequency design and microwave engineering will be a big plus. An ideal candidate will be proactive, curious, innovative, with strong communication skills and able to take projects to completion with minimal supervision. Interested parties should contact Rudy Ramos in Global Staffing Group directly (rudy.r.ramos@xxxxxxx), please feel free to keep me copied (neeraj.pendse@xxxxxxx) Regards, - Neeraj Pendse. Senior Packaging Engineer BGA and Electrical Performance National Semiconductor Corp ------------------------------------------------------------------ To unsubscribe from si-list: si-list-request@xxxxxxxxxxxxx with 'unsubscribe' in the Subject field or to administer your membership from a web page, go to: //www.freelists.org/webpage/si-list For help: si-list-request@xxxxxxxxxxxxx with 'help' in the Subject field List FAQ wiki page is located at: http://si-list.org/wiki/wiki.pl?Si-List_FAQ List technical documents are available at: http://www.si-list.org List archives are viewable at: //www.freelists.org/archives/si-list or at our remote archives: http://groups.yahoo.com/group/si-list/messages Old (prior to June 6, 2001) list archives are viewable at: http://www.qsl.net/wb6tpu