[SI-LIST] Re: Need advice on basic 6-layer stackup - board warpage

--- In si-list@xxxxxxxxxxxxxxx, steve weir <weirsi@xxxx> wrote:

> ... I would be quite hesitant to
> leave a solid plane unbalanced.
> Since you have options that will
> not otherwise impair your design,
> I would employ them.

OK, if I swap the layers as you suggested, from the top down I have:

top copper, mainly breakouts, not much routing
ground plane
power plane
(large layer spacing here, others small)
internal routing
ground place
bottom routing

and the problem is that the power plane isn't balanced by another 
solid plane. As the layer that is opposite to it is one of my two 
routing layers (assuming, as you said, I won't get much routing done 
on the top, which is, in any case, referenced to a different plane) I 
can't do much with that and still hope to route the board. It looks 
as if my main option is to not have a solid power plane at all but 
break it up sufficiently to avoid board warpage. Another option might 
be to have a power plane but no ground plane near the top of the 
board. In both cases, I lose the embedded capacitor and exacerbate 
power distribution problems. I'm not sure I can see a way out of this.

Graham.




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