[SI-LIST] Manager of Package Engineering needed at AMCC in San Diego
- From: "Mark Apton" <mapton@xxxxxxxxx>
- To: si-list@xxxxxxxxxxxxx
- Date: Thu, 10 Apr 2008 17:22:16 -0700
*Manager of Package Engineering;*
**
*Primary Job Responsibilities: *
Will be responsible for managing group of engineers that design and simulate
our packages as well as manage our package and assembly partners. Will also
be interfacing with the various design groups to develop the best technical
packaging solutions with the optimal cost structure. Good project management
skills will be required. Good communication skills required. Must have the
ability to work with chip and board design groups to analyze signal
integrity for products being designed.
*Education Requirement or Equivalent: *
Minimum BSEE/BSME, or equivalent, with 10+ years technical experience in
Package Design and Development.
*Experience Requirement:*
The candidate will need to have 10+ years of progressively increasing
responsibility in the Packaging Design and Development area. Must have
experience managing a design and simulation group for advanced high
performance packaging. Must have a proven track record of shipping wirebond,
flip-chip, plastic, ceramic, CSP, SiP, and PoP products in volume.
*Special Skills or Knowledge Required:*
Should be familiar with Ansoft TPA, HFSS, Q3D, SIWave, Sigrity PowerSI.
Agilent ADS, Flomerics Flotherm, and Cadence Allegro. Experience with >20GHz
package design a plus. Must be able to use Microsoft Project to plan and
track projects.
Please send your resume to;
Mark Apton
AMCC
408 910-6632
mapton@xxxxxxxx
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