[SI-LIST] Looking for SI position

Fabrizio Zanella

6 Tina Road

Milford MA 01757

(508) 478-7455

email: fzanella@xxxxxxxxx

OBJECTIVE: To obtain a position as a hardware design engineer in a growing 
company which provides challenging projects.

QUALIFICATIONS

Thirteen years of experience in signal integrity analysis and hardware design 
of high speed computer system architectures. 

EMPLOYMENT

                    Dec. 1996-Present Signal Integrity Manager, EMC Corp.

Was first signal integrity (SI) engineer at EMC, developed a strong SI group. 
Under my leadership, SI analysis became common practice in every design. 
Provided guidance and feedback for group, evaluated results and developed long 
term strategy. Performed SI analysis of computer nets, from driver to receiver, 
using IBIS and SPICE models. Used Hspice for analysis of high frequency and 
backplane nets and SpecctraQuest for the evaluation of on board nets. Designed 
test boards to characterize backplane signals prior to production boards. 
Analyzed 3.125Gbs serial I/O, using eye pattern, S-parameter and TDR 
measurements. Responsible for creating electrically optimized stackups for all 
boards. Key contributor to system architecture design.

Oct. 1989-Dec. 1996 Signal Integrity Engineer, Teradyne, Inc.

Support of customers on high speed backplane design. Wrote and presented signal 
integrity papers at several conferences. Designed high speed boards and 
connectors. Performed electromagnetic modeling of backplane interconnections 
using Ansoft HFSS, developed spice models of high frequency transmission lines. 
Spice simulation of computer and telecom systems, determining noise budgets, 
optimizing layout of high speed signals. 

Oct. 1986-Sep. 1989 RF Engineer, M/A-COM

Designed and tested coaxial, wave-guide and microstrip transmission line 
microwave components at frequencies up to 30GHz.

EDUCATION

Northeastern University

1981-1986 Northeastern University B.S.E.E. Cum Laude

Courses: High Speed Digital Design, Electromagnetic Compatibility Engineering, 
Electrical Performance of Electronic Packaging.

Also took several leadership classes at EMC.


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