[SI-LIST] Leaving, then re-entering a reference plane
- From: Don Nelson <dhwn@xxxxxxx>
- To: si-list@xxxxxxxxxxxxx
- Date: Wed, 01 Jul 2009 10:09:54 -0400
Hello,
I have a question about the effects of a split reference plane on a signal
that starts and ends referenced to the same plane, but encounters a second
plane along the way. Here's a shot of what I'm talking about:
http://idisk.me.com/dhwn/Public/split_plane.png
All of those signals are part of a source-terminated QDRII (200 MHz) data bus.
In this part of the stackup, the signals are on one layer of a dual-stripline.
The other plane forming the stripline is a solid ground, and there is no solid
ground plane adjacent to the split power plane shown. There are no capacitors
between the two shown power planes. (yes, lots of things wrong there! :-)
Leaving aside the lesser effect of the more distant solid ground plane in the
dual-stripline, what happens to the return currents for these signals? I
assume that the majority of the current flows on Plane 1 around the split back
to the drivers as shown, but the presence of the signal over Plane 2 must
certainly induce a current there, and that's injecting energy into a place that
is not intended. Plane 2 is well decoupled in that vicinity (you can see vias
attached to the plane there--these are decoupling caps) so I'd like to think
that at least medium frequency energy has a path to the gnd plane (and back to
the driver, if a bit circuitously), but what of the higher frequency energy for
which that path is too inductive? I'm still a little new at this and I'm
having trouble "being the signal", as Eric Bogatin might say. :-)
As for crosstalk, these signals are all members of the same bus (clock not
included), and there is a relatively large timing margin to work with. My
working assumption is that the majority of the return current will flow around
the split on Plane 1, so these signals will all inductively couple--but since
they are all members of the same bus and since there is large margin, I'm only
moderately concerned by the edge distortion that will occur as a result. The
only issue is that I'm a little fuzzy on how to *quantify* the amount of
distortion to be sure that it doesn't totally eat up the rest of the margin--I
don't have a simulator that can deal with return paths and am still too much of
a newbie to find a back-o-the-envelope estimate. I am also making the
assumption that the impedance discontinuity over each void is small compared
with the edges of the signal.
EMI? I'm not even sure where to begin predicting that! (that split plane is
layer 2, and layer 1 is a surface microstrip... I've got a bad feeling about
this!)
Thanks in advance to everyone who helps shed some light on this,
Kind regards,
Don Nelson
Netronome Systems
--
Don Nelson
"The whole problem with the world is that fools and fanatics are so sure of
themselves, and wiser people so full of doubt" --Bertrand Russell
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