[SI-LIST] Job Opening Texas Instruments - Dalla, TX

Job opening for an IC Package Electrical Simulation &
Modeling Engineer at Texas Instruments Inc in Dallas,
Texas.

- Support TI Wireless Products new product
introduction by providing package models and model
analysis.
- Experience with package IBIS and Spice models
- Knowledge of various IC package technologies
- Experience with Electromagnetic Field Solvers
- Understanding of System level signal integrity
issues
- Ability to technically communicate with Die, Package
and PCB designers
- Ability to professionally interact with internal
groups and customers
- Ability to meet aggressive schedules
- Must be a team player and understand big picture
- Excellent communication and people skills
- BSEE with 2-3 years (MSEE with 1 year) minimum
experience

This position is currently open and we are actively
seeking qualified candidates.

For more information please contact 

Pete Harper
US Wireless Packaging Manager
(214) 480-1802
pharper@xxxxxx

Norman Case
TI Talent Promoter
Work: 214-480-7011 Mobile: 972-467-4699
Fax: 972-761-6994
ncase@xxxxxx



                
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