[SI-LIST] Re: Importance of Package Height

  • From: "Brent DeWitt" <bdewitt@xxxxxxxxxxxxx>
  • To: <tom.biggs@xxxxxxxxxx>, <gsteinkogler@xxxxxxxxxxxxxxxxxxxx>,<si-list@xxxxxxxxxxxxx>
  • Date: Sun, 3 Mar 2002 18:42:21 -0700

One of the things I've been curious about for a while is the advantage of
using larger footprint devices (maybe 1206 vs. 0603) in the same capacitance
value.  Logic would _seem_ to suggest that the smaller package must be
taller and therefore have a greater current vs. height function.  Since they
have the same 2D length to width, it would seem the larger part would be
preferred.  I don't have the equipment to measure this, so any thoughts
would be appreciated.

Brent DeWitt
Datex-Ohmeda
Louisville, CO

-----Original Message-----
From: si-list-bounce@xxxxxxxxxxxxx
[mailto:si-list-bounce@xxxxxxxxxxxxx]On Behalf Of Tom Biggs
Sent: Friday, March 01, 2002 10:32 AM
To: 'gsteinkogler@xxxxxxxxxxxxxxxxxxxx'; si-list@xxxxxxxxxxxxx
Subject: [SI-LIST] Re: Importance of Package Height



Here is one from Dr. Johnson:
http://www.sigcon.com/articles/edn/vertical.htm

   -tom

-----Original Message-----
From: Steinkogler, Gary [mailto:gsteinkogler@xxxxxxxxxxxxxxxxxxxx]
Sent: Friday, March 01, 2002 7:38 AM
To: si-list@xxxxxxxxxxxxx
Subject: [SI-LIST] Importance of Package Height



Not too long ago I ran across several articles - EDN?, Electronic Design,
PCB Magazine -- on the importance of IC height above the circuit board, but
have not been able to find them.  Can anybody help me locate them?

Gary Steinkogler
Optical Gateway Development
Optical Solutions
16305 36th Ave. North
Suite 300
Minneapolis, MN  55446-2698
Phone:   (763) 268-3633
Fax:   (763) 268-3301
Main:   (763) 268-3300

email:gsteinkogler@xxxxxxxxxxxxxxxxxxxx

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