[SI-LIST] Immediate Signal Integrity Engineer Opening at Xilinx Inc. San Jose
- From: "Ray Anderson" <ray.anderson@xxxxxxxxxx>
- To: <si-list@xxxxxxxxxxxxx>
- Date: Fri, 13 Jan 2006 08:27:00 -0800
The Xilinx Inc. Package Development Engineering Department in San Jose,
CA still has an immediate opening for a Signal Integrity Engineer in our
package characterization group.
This position entails developing full package models for our FPGA parts
by means of 3D FEM extraction as well as lab measurement. The person who
fulfills this position will also be involved in developing s-parameter
based package models for our serdes applications up to 12 GHz and beyond
as well doing cutting edge work to accurately model the SSN performance
of our packages. There is opportunity to provide feedback to package
designers on the current generation parts to help improve their
performance as well as to influence the design of next generation parts
from a SI perspective. The successful candidate will also have the
opportunity to contribute to various 'value-add' projects within our
group that leverage the data in the basic package models we produce.
This position provides the opportunity to work closely with other
development groups within Xilinx providing SI support on packaging
issues as well as with customers, FAEs in the field and marketing. This
position does not entail any regularly scheduled travel. Participation
in relevant standards committees and the publication of technical papers
is encouraged.
For immediate consideration as a candidate this position please forward
your resume and contact information to: ray.anderson@xxxxxxxxxx
Raymond Anderson
Senior Signal Integrity Staff Engineer
Product Technology Department
Advanced Package R&D
Xilinx Inc.
The official job description follows:
Responsibilities
Responsible for post design package electrical data characterization and
analysis and database upkeep. Work will include 3D full extractions as
well as TDR and VNA measurements on multilayer packages. Develop I/O
models of packages as part of package collateral. Be in a position to
support & service unique customer electrical data requirements.
Work with package Designers and suppliers to establish a systematic SI
design flow and alternate design setup approaches that dove-tails into
characterization effort. Establish benchmarks and Roadmaps/template and
techniques for package electrical characterization. Define and implement
ongoing electrical design guideline documentation.=20
Position will require active participation in standard activities (such
as IBIS and JEDEC) and conferences as well as contributing to Field
Engineers training activities.
=20
Job Qual
BSEE or MSEE or related technical degree with at least 5 years
experience in package characterization and Signal Integrity analysis and
support. Candidate should be familiar with and have proven and
demonstrated working knowledge of prevailing high speed modeling and
field solver tools (Paksi-E, Sigrity, HFSS, O-wave etc), and lab
characterization equipment - including Digital Scopes, TDR and VNA
hardware. Candidate should have proven command of scripting language(s)
(such as Perl, unix-shell scripting, VBA, Excel macro scripting etc) for
data manipulation review and analysis. Working knowledge of package CAD
tools will be desirable.
Candidate should be organized and fast learning with good communication
and documentation skills.
=20
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