[SI-LIST] IEEE CPMT Society Phoenix Chapter - 9/3 meeting announcement

  • From: Sam Karikalan <sam_karikalan@xxxxxxxxx>
  • To: si-list@xxxxxxxxxxxxx
  • Date: Mon, 18 Aug 2003 09:50:09 -0700 (PDT)

 IEEE CPMT Society Phoenix Chapter - 9/3 meeting announcement
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Date: September 3, 2003, Wednesday
 
Speaker: Prof. Madhavan Swaminathan, Georgia Tech, Atlanta, GA
 
Topic: Packaging and Integration of Mixed Signal Systems using Organics - A 
Designer's Perspective
 
Location: Motorola, 2100 E. Elliott Rd., Tempe, AZ (Group Conference Room)
 
Time: 5:30-6:00 p.m. - Social/Refreshments; 6:00-7:00 p.m.- Presentation; 7:00 
p.m. Dinner 


IEEE members & non-members all are welcome. 
ABSTRACT
Based on ITRS, long-haul communication bandwidth is estimated to be doubling 
every 9 months, much faster than Moore?s law. This has resulted in the 
explosion of short range, low power communication technologies such as IEEE 
802.11, Bluetooth and Ultra Wide Band. With the transition from 2G to 3G 
technologies, there is a clear need for wireless communications to support 
multiple standards at different frequency bands. In addition, W-LAN (2.44 GHz 
and 5.2 GHz) is considered a complementary access technology, which is 
optimized for high data speeds in low mobility areas. New applications call for 
higher data processing and computing capability in mobile devices, resulting in 
a merger of communication and computing capabilities as never before. All these 
requirements are leading to the development of new technologies for the 
integration of voice, data and multi-media applications into a tightly 
integrated mobile communication/computing device.

Though System on a Chip (SOC) solution provides a platform for integration, not 
every device can be integrated into Silicon due to fundamental, engineering and 
business reasons. These devices can be integrated into the package, often 
referred to as the System on a Package (SOP) solution. Ceramics has been the 
material of choice for such technologies due to superior loss characteristics 
for both digital and RF integration. However, more recently, organic materials 
with medium to low loss characteristics have emerged that can be easily 
processed, support high line densities, are reliable and are considerably lower 
in cost compared to ceramics.

This presentation will discuss the use of organics for the integration of RF 
and digital functions in mixed signal applications. After establishing the need 
for high-Q passive devices to be integrated in the package, the presentation 
will focus on the use of organic materials such as Liquid Crystalline Polymer 
(LCP) and A-PPE for integration. Details on the design, fabrication, packaging 
and manufacturing of these devices will be presented along with examples of 
integrated devices such as filters, baluns, low noise amplifiers, voltage 
controlled oscillators, etc. Finally, the effect of dispersion on the eye 
diagram for digital signaling will be discussed and the performance of the 
organic materials will be quantified.

BIOGRAPHY

Dr. Madhavan Swaminathan is currently a Professor in the School of Electrical 
and Computer Engineering, Georgia Tech and the Associate Director for Systems 
Research at the Packaging Research Center, Georgia Tech. He is a co-founder of 
Jacket Micro Devices, a company specializing in integrated passive devices for 
RF applications. Prior to joining Georgia Tech, he was with the Advanced 
Packaging Laboratory at IBM working on packaging for super computers. Dr. 
Swaminathan has over 150 publications in refereed journals and conferences, has 
co-authored 3 book chapters, has eight issued patents and has nine patents 
pending. He is the recipient of the 2002 Outstanding Graduate Research Advisor 
Award and the 2003 Outstanding Faculty Leadership Award, both from Georgia 
Tech. He is also the recipient of the 2003 Presidential Special Recognition 
Award from IEEE CPMT Society for his leadership of TC-12. He is a Senior Member 
of IEEE.




 

Regards,

Sam Karikalan, Asst. Program Chair, IEEE CPMT Society Phoenix Chapter

Tel. (602) 659 4634     E-mail. sam.kvk@xxxxxxxxxxxxx


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