IEEE CPMT Society Phoenix Chapter - 9/3 meeting announcement -------------------------------------------------------------------------------------------------- Date: September 3, 2003, Wednesday Speaker: Prof. Madhavan Swaminathan, Georgia Tech, Atlanta, GA Topic: Packaging and Integration of Mixed Signal Systems using Organics - A Designer's Perspective Location: Motorola, 2100 E. Elliott Rd., Tempe, AZ (Group Conference Room) Time: 5:30-6:00 p.m. - Social/Refreshments; 6:00-7:00 p.m.- Presentation; 7:00 p.m. Dinner IEEE members & non-members all are welcome. ABSTRACT Based on ITRS, long-haul communication bandwidth is estimated to be doubling every 9 months, much faster than Moore?s law. This has resulted in the explosion of short range, low power communication technologies such as IEEE 802.11, Bluetooth and Ultra Wide Band. With the transition from 2G to 3G technologies, there is a clear need for wireless communications to support multiple standards at different frequency bands. In addition, W-LAN (2.44 GHz and 5.2 GHz) is considered a complementary access technology, which is optimized for high data speeds in low mobility areas. New applications call for higher data processing and computing capability in mobile devices, resulting in a merger of communication and computing capabilities as never before. All these requirements are leading to the development of new technologies for the integration of voice, data and multi-media applications into a tightly integrated mobile communication/computing device. Though System on a Chip (SOC) solution provides a platform for integration, not every device can be integrated into Silicon due to fundamental, engineering and business reasons. These devices can be integrated into the package, often referred to as the System on a Package (SOP) solution. Ceramics has been the material of choice for such technologies due to superior loss characteristics for both digital and RF integration. However, more recently, organic materials with medium to low loss characteristics have emerged that can be easily processed, support high line densities, are reliable and are considerably lower in cost compared to ceramics. This presentation will discuss the use of organics for the integration of RF and digital functions in mixed signal applications. After establishing the need for high-Q passive devices to be integrated in the package, the presentation will focus on the use of organic materials such as Liquid Crystalline Polymer (LCP) and A-PPE for integration. Details on the design, fabrication, packaging and manufacturing of these devices will be presented along with examples of integrated devices such as filters, baluns, low noise amplifiers, voltage controlled oscillators, etc. Finally, the effect of dispersion on the eye diagram for digital signaling will be discussed and the performance of the organic materials will be quantified. BIOGRAPHY Dr. Madhavan Swaminathan is currently a Professor in the School of Electrical and Computer Engineering, Georgia Tech and the Associate Director for Systems Research at the Packaging Research Center, Georgia Tech. He is a co-founder of Jacket Micro Devices, a company specializing in integrated passive devices for RF applications. Prior to joining Georgia Tech, he was with the Advanced Packaging Laboratory at IBM working on packaging for super computers. Dr. Swaminathan has over 150 publications in refereed journals and conferences, has co-authored 3 book chapters, has eight issued patents and has nine patents pending. He is the recipient of the 2002 Outstanding Graduate Research Advisor Award and the 2003 Outstanding Faculty Leadership Award, both from Georgia Tech. He is also the recipient of the 2003 Presidential Special Recognition Award from IEEE CPMT Society for his leadership of TC-12. He is a Senior Member of IEEE. Regards, Sam Karikalan, Asst. Program Chair, IEEE CPMT Society Phoenix Chapter Tel. (602) 659 4634 E-mail. sam.kvk@xxxxxxxxxxxxx --------------------------------- Do you Yahoo!? Yahoo! SiteBuilder - Free, easy-to-use web site design software ------------------------------------------------------------------ To unsubscribe from si-list: si-list-request@xxxxxxxxxxxxx with 'unsubscribe' in the Subject field or to administer your membership from a web page, go to: //www.freelists.org/webpage/si-list For help: si-list-request@xxxxxxxxxxxxx with 'help' in the Subject field List archives are viewable at: //www.freelists.org/archives/si-list or at our remote archives: http://groups.yahoo.com/group/si-list/messages Old (prior to June 6, 2001) list archives are viewable at: http://www.qsl.net/wb6tpu