[SI-LIST] Hyperlynx Results interpretation

Hi
I had a couple of questions of interpreting the results from Hyperlynx if 
any of the experts out their may know the answer or point me to the 
answer.

1.  Does Hyperlynx simulate the ESD protection diodes through the 
ground/vcc clamp parameter in the IBIS model or is it omitted to show real 
levels in the trace.  I ask this, because if they do then the levels of 
overshoot/undershoot would likely be higher and other ICs could be 
buffering other parts by clamping the waveform before it exceeds their 
min/max specification.

2.  Using the oscilloscope in Hyperlynx they give the current waveform in 
the CSV output file.  Is this the current measured in the trace connecting 
to the driver, or is it the current that is actually entering the 
protection diodes/parasitic capacitance of the part?

Sorry, if this questions seem trivial.  I want to make sure that when I 
see overshoot/undershoot that I correctly interpret the levels to make 
recommendations.

Any other information on interpreting/using Hyperlynx for SI application 
would be greatly appreciated.

Erin McPhalen

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