Hi everyone, So I have a question. When designing a power supply distribution system (PDS) for an FBGA bond-wire ASIC package, how many bond-wires are "enough?" I understand that 25um(1 mil) diameter bond-wires can accommodate almost 1 Amp at DC, but I suspect this is completely off base when driving a bus with one of these. The background on my situation involves DDR-2 drivers, and having enough bond-wires to prevent SSO. This IC package is an FBGA, 4 layer substrate board. The IP vendor supplied pin-based RLC charts for a lead-frame type package (although I have yet to see DDR-2 in a TSSOP). These translate well to signal routes, but the physics the PDS are different than lead-frame pin structures. Also this vendor's numbers for power are based literally on a "rule of thumb chart," which to me is code for "open your SI tool and double check." We wrestled them into giving us Spice versions of the buffer under NDA, so presumably we can simulate this ourselves. Anyhow if you guys have advice, I could use it. Thanks in advance, -Graham [gmail search terms: bondwire bond-wire wirebond wire-bond] ------------------------------------------------------------------ To unsubscribe from si-list: si-list-request@xxxxxxxxxxxxx with 'unsubscribe' in the Subject field or to administer your membership from a web page, go to: //www.freelists.org/webpage/si-list For help: si-list-request@xxxxxxxxxxxxx with 'help' in the Subject field List technical documents are available at: http://www.si-list.net List archives are viewable at: //www.freelists.org/archives/si-list or at our remote archives: http://groups.yahoo.com/group/si-list/messages Old (prior to June 6, 2001) list archives are viewable at: http://www.qsl.net/wb6tpu