[SI-LIST] Re: How does multiple Ghz high speed signal behave on a sheet of conductor plane?

Dong, bypass capacitance: in the die, as part of the PCB assembly and/or 
the the IC package is all that can save you from the evils of 
inductance. The DC/DC converter and its output capacitors becomes 
largely irrelevant by about 1MHz.

Steve
Dong Kim wrote:
> My bottom-line effort is:
>   trying to minimize inductance between power source and a very high speed 
> switching component (multiple Ghz). 
>   The 1 oz. power plane size is approximately 14”x12”.
>   The distance between the DC/DC power source to high speed switching IC is 
> about 6 inches.
>   The IC’s internal 256bit bus switching speed is greater than 3Ghz.
>    
>   I am concerned about the high speed noise generated by the IC switching 
> feedback into the power source.
>   As the signal switching speed gets faster, I heard not only the skin effect 
> kicks-in but also the signal tends to flow straight, forming a narrow strip 
> path on the conductor sheet.
>   If the signal only flows thru the narrow strip of conductor, major portion 
> of the large sheet of conductor is no longer a good conductor for the noise. 
> It may just become an inductor in the high speed noise perspective.  In 
> another word, the large sheet of conductor is useless for the effort of 
> minimizing inductance.
>   Let me know if I am understood the concept straight.
>    
>   Please advice me with your expert opinion.
>    
>   Thanks
>    
>   Dong Kim
>    
>        
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