My bottom-line effort is:
trying to minimize inductance between power source and a very high speed
switching component (multiple Ghz).
The 1 oz. power plane size is approximately 14?x12?.
The distance between the DC/DC power source to high speed switching IC is
about 6 inches.
The IC?s internal 256bit bus switching speed is greater than 3Ghz.
I am concerned about the high speed noise generated by the IC switching
feedback into the power source.
As the signal switching speed gets faster, I heard not only the skin effect
kicks-in but also the signal tends to flow straight, forming a narrow strip
path on the conductor sheet.
If the signal only flows thru the narrow strip of conductor, major portion of
the large sheet of conductor is no longer a good conductor for the noise. It
may just become an inductor in the high speed noise perspective. In another
word, the large sheet of conductor is useless for the effort of minimizing
inductance.
Let me know if I am understood the concept straight.
Please advice me with your expert opinion.
Thanks
Dong Kim
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