[SI-LIST] Re: High IO 1mm Pitch FPGAs Top Bottom Board Assembly
- From: Jeff Seeger <jseeger@xxxxxxxxxxxxxx>
- To: si-list@xxxxxxxxxxxxx
- Date: Fri, 16 Jan 2004 09:42:51 -0500
Lum Wee Mei wrote:
> snip <
> I am not a assembly gal but I have heard that pallets are used to
> support them at the bottom to prevent them from falling regardless with
> or without heat sink.
>
Actually the surface tension of solder across the large
number of balls may be perfectly alright. There is a
calculation that I thought I'd have dug up by now that
will help.
It is also possible to use higher temperature solder for
the first side assembled, if all parts on that side are
robust enough for the higher assembly temps.
--
Jeff Seeger Applied CAD Knowledge Inc
Chief Technical Officer Tyngsboro, MA 01879
jseeger "at" appliedcad "dot" com 978 649 9800
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