Hi , I have a four layered PCB ,Sig,Gnd,Pwr & Sig.The gnd & power are 1 Oz copper. Does the heat dissipation of the PCB's improve , if the thickness of the Power planes is increased to 2 oz Cu.Vice versa , does the heat dissipation go bad upon decreasing the thickness of the Power planes to 1/2 Oz. I have two PCB's from two fab houses (Basically same Gerbers).The heat dissipation from on one of these is bad as the board from the other fab house seems lot better in this regard. I'am interested to investigate into this.Pls suggest me the things to look for here. Thanks in advance!! Best regards Sunil ------------------------------------------------------------------ To unsubscribe from si-list: si-list-request@xxxxxxxxxxxxx with 'unsubscribe' in the Subject field or to administer your membership from a web page, go to: //www.freelists.org/webpage/si-list For help: si-list-request@xxxxxxxxxxxxx with 'help' in the Subject field List technical documents are available at: http://www.si-list.net List archives are viewable at: //www.freelists.org/archives/si-list or at our remote archives: http://groups.yahoo.com/group/si-list/messages Old (prior to June 6, 2001) list archives are viewable at: http://www.qsl.net/wb6tpu