[SI-LIST] Ground clearance at connector vias

I have a question regarding ground clearances for signal vias in a
backplane connector, like the Molex/Teradyne HSD.  Connector and
semiconductor manufacturers recommend using an oval ground clearance
around the differential pairs, to minimize reflections.
Do you agree with this recommendation, especially at signal speeds of
2.5Gbs and above?  Can anyone share their experiences?  How large should
the clearance be on the backplane?

Thanks and regards,

Fabrizio Zanella
Principal Hardware Design Engineer
Broadbus Technologies
fzanella@xxxxxxxxxxxx
=20
--------------------------------------------------------

=20
This email message and any files transmitted with it contain =
confidential information intended only for the person(s) to whom this =
email message is addressed.  If you have received this email message in =
error, please notify the sender immediately by telephone or email and =
destroy the original message without making a copy.  Thank you.=20
=20
------------------------------------------------------------------
To unsubscribe from si-list:
si-list-request@xxxxxxxxxxxxx with 'unsubscribe' in the Subject field

or to administer your membership from a web page, go to:
http://www.freelists.org/webpage/si-list

For help:
si-list-request@xxxxxxxxxxxxx with 'help' in the Subject field

List archives are viewable at:     
                http://www.freelists.org/archives/si-list
or at our remote archives:
                http://groups.yahoo.com/group/si-list/messages 
Old (prior to June 6, 2001) list archives are viewable at:
                http://www.qsl.net/wb6tpu

Other related posts: